Inventec Launches Enhanced Co-Solvent


Reading time ( words)

For almost 2 decades, the Topklean EL 20 product range from Inventec Performance Chemicals (Inventec) has been the best in class co-solvent agent to be used mixed or separated with HFEs (hydrofluoroether) in vapour phase cleaning systems to remove solder flux residues, before application of conformal coatings, underfills or wire bonding process.

The cleaning action to remove baked-on solder flux residues after reflow, also known as defluxing, from printed circuit boards and power semiconductors has become more and more challenged because of the higher densities in today’s electronics, miniaturization, lower stand off components, and complex geometries This situation becomes even more difficult in lead free assembly where higher process temperatures are applied causing charring to flux residues.

The Topklean EL20P is the newest product in the range, it has been designed in response to the latest defluxing needs, formulated to have an outstanding capillary action by taking into consideration two main parameters: the penetration coefficient and the solvency power, it has a lower surface tension compared to other co-solvent agents in the market. The high wetting performance of Topklean EL20P allows to efficiently clean lead free fluxes after reflow which are hard to remove. Miniaturization and advanced packaging should not become a challenge for reliability anymore.

The main benefits offered by Topklean EL20P are:

  • Enhanced solvency power to dissolve and remove Lead Free flux residues
  • Faster cycle time due to its higher solvency and rinsing capabilities
  • Lower ionic contamination
  • Improved environmental performance. It is not toxic, it has a very low environmental impact and its formulation includes a high percentage of renewable raw materials.
  • Great materials compatibility including labels placed on PCBA before cleaning process.
  • Fully compatible with main vapour phase cleaning systems available in the market

Topklean EL20P is available worldwide in 20 l and 200 l drum containers.

About Inventec Performance Chemicals

Inventec is a division of the Dehon Group with head offices in Vincennes, France. The Electronic Business Unit is specialised in developing, manufacturing and supplying soldering, cleaning & coating materials used in the assembly of printed circuit boards and semiconductor packaging, contributing to sustainable development for high tech industries including automotive, telecom, industrial, energy, LED lighting, rail, aerospace, military and semiconductor. Inventec has 11 subsidiaries around the world, and production sites in France, Switzerland, Malaysia, China, United States and Mexico; all ISO 9001 certified and equipped with control and application laboratories to guarantee traceability, compliance with industry standards and consistency from batch to batch.

Share

Print


Suggested Items

SMTA Europe Webinar: What Is a Good Solder Joint, and How Can Solder Joints Be Tested?

11/18/2020 | Pete Starkey, I-Connect007
What is a good solder joint? And how can they be tested not only for purposes of process characterisation, optimisation, monitoring, and control but also for ensuring their long-term reliability? Pete Starkey details a webinar organised by the Europe Chapter of SMTA that was presented by Bob Willis, an expert in soldering, assembly technologies, and failure analysis.

This Month in SMT007 Magazine: Test and Measurement in a Smart Factory

11/03/2020 | Nolan Johnson, I-Connect007
Nolan Johnson spoke with MIRTEC President Brian D’Amico about how the role of test and measurement equipment is changing in the smart factory and how shops can adjust to make use of the new technology. D’Amico shares this insight: “While approximately 90% of U.S. electronics manufacturers recognize the potential of Industry 4.0 to improve productivity, many are slow to adopt smart factory solutions within the manufacturing process.”

Reducing Flux Splatter in Sensors and Camera Modules

10/30/2020 | Jasbir Bath, Shantanu Joshi, and Noriyoshi Uchida, Koki Solder America And Koki Company Limited
With the increased use of electronics in new technology areas, flux formulations are being developed to address the new and existing requirements. For sensors and camera modules used for Advanced Driver Assistance System (ADAS) and internet of things (IoT) applications, there is a demand for no-clean flux formulations in lead-free solder paste, which can reduce flux splattering during reflow.



Copyright © 2020 I-Connect007. All rights reserved.