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Alpha, the world leader in the development and production of electronic soldering materials, was honored with “The Best Conference Paper Award of 2015 China International Solder Technology Forum & Exhibition” held on September 17th in Suzhou, China.
The technical paper, titled “Thermal and Mechanical Reliability of Low-Temperature Solder Alloys for Handheld Devices” was presented by Andy Yuen, Technical Services Director of Alpha Southern China and focused on discussing the use of micro-additives in eutectic Sn-Bi alloys to improve thermal fatigue and mechanical shock properties for handheld devices.
“We developed a new low temp, Pb-free, no-silver alloy with enhanced mechanical properties, particularly higher tensile strength and impact energy, which resulted in improved drop shock performance over standard SnBi alloy systems” said Andy. “The alloy is capable of delivering high reliability performance at lower soldering temperatures, leading to increased throughput and production value in your assembly process.”
Alpha’s paper was chosen from more than ten technical papers that were presented at the conference from well-known industry members. The CISTF Conference is jointly held by the ITRI-IPC China Solder Technology Group, International Tin Research Institute (ITRI, China) and IPC Association Connecting Electronics Industries (China) and was attended by around 250 industry affiliates.
To learn more about Alpha’s vast product offering and capabilities, please visit our site at alpha.alent.com.
Andy Yuen is the Technical Services Director of Alpha Southern China. Andy joined Alpha in 1978 and has held technical support responsibilities in the Asia-Pacific Region for more than 30 years. He is a frequent speaker on soldering materials, especially related to Surface Mount Assembly Technology and Reflow/Wave Lead Free Soldering. Andy is a graduate of Queen’s University at Kingston, Ontario, Canada and holds a Bachelor Degree in Chemical Engineering. He is a member of SMTA, IMAPS and ACS.
Alpha, a business unit of Alent plc, is the global leader in the development, manufacturing and sales of innovative specialty materials used in a wide range of industry segments, including electronics assembly, power electronics, die attach, LED lighting, photovoltaics, semiconductor packaging, automotive and others.
With a unique global presence in over 30 locations throughout the Americas, Europe and Asia Pacific regions, Alpha supplies a full line of ALPHA® electronics assembly material products, including Solder Paste, Exactalloy® Solder Preforms, Cored Solder Wire Solder, Wave Soldering Fluxes, Bar Solder Alloys, and Stencils. It offers die attach product technologies to the power electronics segment in its Argomax®, Atrox™, Maxrel™, and Fortibond™ brands.
For the LED segment, Alpha offers its Lumet™ products covering applications from die attach to systems assembly in the LED manufacturing process. Alpha also offers product technologies for the Photovoltaic segment, including high performance liquid fluxes and solder alloys for producing standard ribbon and bus bar, as well as, liquid fluxes, solder pastes, cored wire, conductive adhesives and preforms for use in used in PV module assembly. Also, Alpha’s Advanced Materials unit is the leader in electronic polymers and solder materials for semiconductor packaging applications.
Since its founding in 1872, Alpha has been committed to developing and manufacturing the highest quality specialty materials. For more information, visit www.alpha.alent.com.