IPC Seeks Posters for Display and Presentation at IPC APEX EXPO 2016


Reading time ( words)

IPC—Association Connecting Electronics Industries is seeking technical posters for presentation at the upcoming IPC APEX EXPO 2016 trade event, which will be held from March 15 to 17, 2016, at the Las Vegas Convention Center in Las Vegas, Nevada.

Submissions are being sought in all areas of the electronics industry, including design, materials, assembly, processes, and equipment; and topics may be on automation in electronics manufacturing, adhesives, assembly and rework processes, BGA/CSP packaging, black pad and other board-related defect issues, business and supply chain issues, cleaning, conformal coatings, corrosion, counterfeit electronics, failure analysis, flexible circuitry, PCB fabrication, robotics, soldering, surface finishes, test, inspection and AOI, tin whiskers, and many more.

The deadline for submission of abstracts is on December 11, 2015.

For more information about conference participation, please contact IPC Technical Conference Director Jasbir Bath or IPC Technical Programs Coordinator Toya Richardson at +1 847-597-2823.

Share

Print


Suggested Items

Rogers Continues to Grow and Adapt

02/28/2020 | Real Time with...IPC
In this video interview from the show, Guest Editor Judy Warner and Tony Mattingly, senior product manager at Rogers Corporation, discuss the state of materials at the company, as well as the Rogers innovation centers the company has opened recently.

Randy Cherry: IPC Validation Services Continues to Expand

02/27/2020 | Real Time with...IPC
In this video interview from the show, Randy Cherry, IPC's director of validation services, gives Guest Editor Judy Warner his annual update on IPC's Validation Services, which is growing along with ever-increasing IoT and connectivity.

Ventec’s Materials are Enablers for 5G, Industry 4.0

02/26/2020 | I-Connect007 Editorial Team
In this video interview from the show, Technical Editor Pete Starkey and Ventec COO for Europe and the Americas Mark Goodwin discuss Ventec’s latest high-speed, low-loss, high-frequency materials as enablers for 5G and Industry 4.0.



Copyright © 2020 I-Connect007. All rights reserved.