Valtronic’s VP of Technology to Participate in BMES Panel


Reading time ( words)

Valtronic, contract manufacturer of miniaturized electronic products for trusted medical device partners, announces that Don Styblo, its co-founder & vice president of technology, will be a panelist at the BMES Midwest Regional Conference on Friday, November 6th at The University of Akron. The conference is hosted by the Biomedical Engineering Department at Akron and is a BMES event. Don will participate in the BME Careers I panel from 9:30-10:45 a.m. This will be a moderated discussion on careers for biomedical engineers in industry.

Hosted by The University of Akron, the Midwest Biomedical Engineering Regional Conference is a unique one-day conference that is designed specifically for biomedical engineering students (undergraduate, graduate and post-doctorates) and working professionals. The conference provides a wealth of career information and networking opportunities, and also showcases the host school’s BME program, students, alumni and faculty.  

Don has 50+ years of experience in the electronics’ industry in electronic design and manufacturing using technologies that include chip-on-board, flip chip and SMT. In 1986, Don was a co-founder in establishing Valtronic Technologies (USA), Inc. in the Cleveland, Ohio area. Importing the advanced microelectronics packaging expertise from Valtronic SA in Switzerland, VTI expanded from a small office and lab to build a 70,000 sq ft engineering and manufacturing facility complete with two clean rooms, which includes a Bio-Clean Room in Solon, Ohio. Currently, VTI successfully manufactures more than 100 different miniaturized electronic medical devices and sensors ranging in quantities from prototyping to high volumes.

About Valtronic

We innovate and manufacture miniaturized electronic products for our trusted medical device partners. We produce integrated electronic and mechanical products. Our customers are leading global suppliers of medical implants and devices, diagnostic imaging equipment and sensitive aerospace and industrial assemblies. For over 30 years we have helped hundreds of companies develop and produce Class II & III medical devices and advanced miniaturized electronic assemblies.

Share

Print


Suggested Items

KYZEN’s Popular Cleaning Series Continues

11/25/2020 | I-Connect007 Editorial Team
Wondering what to look for in a PCB cleaning agent? In just 10 minutes, you will learn from Jack Reinke what impacts your waste stream as part of the latest installment of KYZEN’s Tech2Tech series. This special webinar is held live at two times: 7:18 a.m. and 5:33 p.m. PST December 3, 2020.

IPC Standards Development: Business Challenges and an Inside View

10/28/2020 | Graham Naisbitt, Gen3 Systems
With increasing frequency, standardising the standards, such as ISO 9201, imposes certain rules that must be met to ensure “fair play” amongst the supply chain. There will be those familiar with hearing about “false positives/negatives” and “never trust the salesman,” so mitigating these is no easy task. However, there is the chance for each 5-30 Task Group to review industry requirements and set out the work program for the ensuing period. With that in mind, much of what follows is based on comments we learn about from our industry around the world, many of whom are not yet IPC members. Yes, this is a membership recruitment drive, unashamedly, as well as a search for volunteers willing to help create the standards of tomorrow.

Real Time with… SMTAI 2020: Women’s Leadership Program Cruises Through Important Topics

10/09/2020 | Michelle Te, I-Connect007
The virtual environment didn’t stop a large gathering of women (and men) from learning, sharing, and enjoying the Women’s Leadership Program during SMTAI 2020. Michelle Te shares her experience.



Copyright © 2020 I-Connect007. All rights reserved.