SMTA's Pan Pacific Microelectronics Symposium Program Finalized

Reading time ( words)

SMTA announced that the program is finalized for the 21st Annual Pan Pacific Microelectronics Symposium.  The event will take place January 25-28, 2016 at the Hapuna Beach Prince Resort on the Big Island of Hawaii.  The Pan Pacific promotes international technical interchange and provides a premier forum for extensive networking among industry professionals and business leaders throughout the world.

The technical sessions, with over 50 presentations, will include Nanotech Joining, Automotive Electronics, Solder Technologies, Optoelectronics and Power, Design and Manufacturing Strategies, Advanced X-Ray Inspection, Wearable Electronics, Materials Reliability Impact, Interposer Technologies (TSV), Reliability Strategies, Test and Failure Analysis.

On the afternoon of Monday, January 25, a plenary keynote session will kick off the event featuring presentations on Application of Nanostructuring, Nanomaterials, and Micro-Nano-Integration

for Improved Components and System's Performance; 3D-Printing and Electronic Packaging; New Lithium Ion Cell Technologies; Digital Health; and Employee Job Satisfaction and Leadership Style.

On Tuesday, January 26, Dwight Howard, Delphi, will deliver the keynote lunch talk on “The Rapid Evolution of Automotive Features and Demands for Advanced Microelectronics Solutions.” On Wednesday, January 27, Michael Pecht, Ph.D., University of Maryland, will deliver the lunch keynote on “Re-thinking Reliability - A Perspective from a U.S. National Academy of Science Study Committee.” Meyya Meyyappan, Ph.D., NASA Ames Research Center, will deliver the final keynote lunch presentation about “Nanotechnology in Future Nanoelectronics” on Thursday, January 28.

View the complete program and register at the website:  Please contact Tanya Martin, or 952-920-7682, with questions about the program. Promotional packages are available for companies wishing to have exposure for their products and services. Contact Jae Gullings,, for details.

About SMTA

The SMTA membership is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations.



Suggested Items

What’s Driving AOI Innovation and Collaboration?

03/25/2020 | Brent Fischthal, Koh Young America
When we look at the optical inspection market growth trajectory, we can see how process challenges helped create innovations. For example, solder paste inspection (SPI) has undergone a shift from 2D to 3D because the 2D inspection technologies manufacturers traditionally used to collect solder deposit images could not solve shadowing problems. Thus, companies developed 3D SPI to capture the printed solder paste height to accurately measure the total volume of paste printed. Several years later, we see the same need for surface-mounted component inspection with AOI systems.

AIM Appoints Oscar Hernandez as Sales Manager for Queretaro and Bajio Regions Mexico

03/24/2020 | AIM Solder
AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce the appointment of Oscar Hernandez to the position of Sales Manager for the Queretaro and Bajio regions of Mexico.

Trends From the Show: Solder and Software

03/18/2020 | Nolan Johnson, I-Connect007
In my role as a media representative, my perspective on IPC APEX EXPO may be a bit different from that of many attendees. Since the I-Connect007 team had the opportunity to talk to many attendees and exhibitors and listen to their stories over the course of the week, our view can be particularly wide. When I reflected on all the conversations, pieces from all throughout the week coalesced and provided a different understanding of and takeaway from the show.

Copyright © 2020 I-Connect007. All rights reserved.