-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueBox Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
Boost Your Sales
Every part of your business can be evaluated as a process, including your sales funnel. Optimizing your selling process requires a coordinated effort between marketing and sales. In this issue, industry experts in marketing and sales offer their best advice on how to boost your sales efforts.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
SolderStar Joins Industry Experts at Seminar to Address Profiling Techniques
November 30, 2015 | SolderStarEstimated reading time: 2 minutes
SolderStar joined industry experts from the electronics manufacturing sector to address the issues surrounding thermal profiling for today’s highly complex assemblies and discuss the way this impacts the manner in which the industry measures component temperatures accurately.
The one-day event held at The Manufacturing Technology Centre in Coventry, UK gave attendees the opportunity to learn new methods and understand issues surrounding profiling techniques, including attachment method best practice, process setup and profile optimisation scenarios for lower energy use or higher throughputs.
SolderStar a leading specialist manufacturer in the design and development of thermal profiling equipment for the lead-free electronics industry, concentrated their thoughts on the reflow process control, the need for the practice, and how modern technologies and processes lead to 100% traceability.
Keith Blakeley, SolderStar Product Manager said: “The seminar was a great opportunity to meet the engineers who work in the electronics manufacturing and design sector.
“We concentrated our presentation on why we need to actively control processes used in manufacturing and the factors driving this need. Producing electronic assemblies without a known thermal profile is detrimental. Without an established oven profile, problems can occur with soldering quality, cleaning issues or further down the line involving either rework costs or early component failures, a major cost in today’s increased manufacture of micro-assemblies. A poor thermal profile can be one of the main factors contributing to manufacturing defects within reflow soldering.
Page 1 of 2
Suggested Items
Women MAKE Awards Recognizes GlobalFoundries’ Jennifer Robbins and Katelyn Harrison for Manufacturing Excellence
04/24/2024 | GlobalFoundriesThe Manufacturing Institute (MI)—the workforce development and education affiliate of the National Association of Manufacturers—honored two outstanding women from GlobalFoundries (GF) at their annual Women MAKE Awards. Jennifer (Jenny) Robbins, Senior Director, Central Facilities, was recognized as a 2024 Women MAKE Awards Honoree, while Katelyn Harrison, Senior Integration Engineer, was honored as an Emerging Leader.
GlobalFoundries Commits to Achieving Net Zero Emissions and Carbon-Neutral Power by 2050
04/23/2024 | GlobalFoundriesGlobalFoundries (GF) is furthering its commitment to sustainable operations and fighting climate change with the announcement of two new long-term goals to achieve net-zero greenhouse gas (GHG) emissions and 100% carbon-neutral power by 2050.
ROHM Group Company SiCrystal and STMicroelectronics Expand Silicon Carbide Wafer Supply Agreement
04/23/2024 | ROHMROHM and STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, announced today the expansion of the existing multi-year, long-term 150mm silicon carbide (SiC) substrate wafers supply agreement with SiCrystal, a ROHM group company.
IDTechEx Report Unveils 3D Electronics Status and Opportunities
04/22/2024 | PRNewswire3D electronics is an emerging manufacturing approach that enables electronics to be integrated within or onto the surface of objects. 3D electronic manufacturing techniques empower new features, including mass customizability, greater integration, and improved sustainability in the electronics industry.
Altus Group Helps BitBox Unlock Productivity and Efficiency Gains with New Reflow Oven
04/22/2024 | Altus GroupAltus Group, a leading provider of capital equipment, has recently assisted BitBox, a UK-based electronics design, engineering and manufacturing company in upgrading its operations with the implementation of a new reflow oven from Heller Industries.