Alpha to Feature its First Sintering Preforms at Internepcon Japan 2016


Reading time ( words)

Alpha Assembly Solutions, the world leader in the production of electronic soldering materials, plans to feature the ALPHA Argomax Ag sinter product range at the 2016 INTERNEPCON JAPAN show to be held in Tokyo from January 13–15.

Alpha will demonstrate its new Argomax 9000 Silver Sintering Preforms which is a world first for the Power Semiconductor Industry. These innovative preforms deliver superior thermal conductivity, ultra-high reliability and excellent electrical conductivity. They have shown excellent performance in large area attachment and can help to simplify the manufacturing process.

"This year we launched one of our most innovative products, the ALPHA Argomax 9000 preforms," said Julien Joguet, Alpha's Global Product Manager for Sintered Materials. "Up until now, ALPHA Argomax has only been available in both paste and film formats, but now we are the first to introduce a sintering product in a preform format to widen our product portfolio and extend the superior capabilities of Argomax."

Argomax 9000 preforms are proving to the most reliable die attach materials on the market. It can be used in a range of applications from power modules to automotive applications, in areas in which thermal and electrical conductivity and joint strength is crucial. The preforms are available for sampling in tape and reel format and waffle pack for standard pick and place equipment.

To learn of other “Alpha firsts” in the semiconductor industry, please visit us at INTERNEPCON JAPAN - Hall East 5-4 and discover the multiple manufacturing process options that ALPHA Argomax offers.

Share

Print


Suggested Items

Comparing Soldering Results of ENIG and EPIG Post-steam Exposure

09/11/2019 | Jon Bengston and Richard DePoto, Uyemura International USA
Electroless nickel immersion gold (ENIG) is now a well-regarded finish used to enhance and preserve the solderability of copper circuits. Electroless palladium immersion gold (EPIG), meanwhile, is a new surface finish also for enhancing and preserving solderability—but with the advantage of eliminating electroless nickel from the deposit layer. This feature has become increasingly important with the increasing use of high-frequency PCB designs whereby nickel’s magnetic properties are detrimental.

PCB Design Training: More Critical Than Ever

09/05/2019 | Andy Shaughnessy, Design007 Magazine
I interviewed Gary Ferrari of FTG at the IPC High-Reliability Forum and Microvia Summit in Baltimore. Gary is a co-founder of the IPC Designers Council and a longtime advocate for PCB design and PCB designers. We discussed the crucial role that PCB designers play in the entire electronics development process, and how IPC and the Designers Council are helping to educate and inform the next generation of designers.

eSMART Factory Conference 2019, Day 1

09/02/2019 | Happy Holden, I-Connect007
The recent eSMART Factory Conference in June in Dearborn, Michigan, was the second annual conference on the smart factory. SMTA described it as "A technical conference with a focus on electronics manufacturing from software systems/processes to augmented reality and smart inspection." In this article, Happy Holden gives us the highlights of the conference.



Copyright © 2019 I-Connect007. All rights reserved.