Pete’s Top Ten SMT Articles for 2015
1. The SMT Internet of Things—Back to Basics
Different people have different understandings and expectations about what the internet of Things (ioT) actually is, especially with respect to how it could work and what it could bring to the SMT assembly industry. There are a lot of expectations to fulfil as principles behind innovations such as industry 4.0 take hold.
2. Declaring War on Failure in electronics
Failure, in electronics, while not necessarily desired by either manufacturer or consumer, is expected. This is not to say that the industry has not attempted to improve reliability. In this article, Verdant Electronics’ Joseph Fjelstad writes that much is being done in an effort to improve reliability with new solder alloys, new fluxes, new materials, new equipment and process parameters.
3. The Rise of Structural Electronics
Structural electronics is one of the most important technological developments of this century. it forms a key part of the dream, first formulated 30 years ago, of computing disappearing into the fabric of society. It also addresses, in a particularly elegant manner, the dream of Edison in 1880 that electricity should be made where it is needed.
4. Time to Ditch Heavy Metal for Soft Rock?
Yash Sutariya and Thomas S. Tarter shine a light on the often overlooked topic when it comes to PCBs for lEDs: reliability. They wrote that composite materials can provide both a thermal management solution and a dimensional stability solution that has not yet been presented through conventional materials.
5. Cutting Cost, Not Price
In any supply chain survey, the issue of cost comes up repeatedly. This article explores the downside of focussing on price and suggests some of the practical ways you can reduce costs without having a negative impact on your product.
6. Automotive EMS—Going Beyond Assembly
The trend toward outsourcing in the automotive industry continues as automotive manufacturers strive to capitalize on the technical expertise and cost effectiveness of the EMS providers. For their part, the automotive EMS players have expanded their role through vertical integration and venture into the realm of non-electronics manufacturing.
7. Value Stream Mapping—Operationalizing Lean Manufacturing
by applying value stream mapping (VSM), EMS providers can have a clearer picture of multiple processes involved in a work flow, identify waste and its sources, identify where change is required, standardize the process, and identify potential problems that could be encountered in the future state. It can also be used as a tool for planning as well as for managing changes.
8. Jetting Strategies for mBGAs—A Question of Give and Take
Among the alternatives for the deposition of solder paste and other fluids on a PCB is jetting, which offers advantages concerning precise volume repeatability, software control and local volume control. The goal of this study is to examine the effect of piezo actuation profile on deposit quality with respect to positioning, shape and satellite levels in order to achieve adequate deposition quality for applications such as 0.4 mm BGA.
9. The Unpredictability of Tin Whiskers Endures
Into decade number two of the European Union’s RoHS and REACH restrictions for the use of lead in electronic components, the risk of tin whiskers in critical circuitry continues. This article will explore a tin whisker mitigation process for surface mount electronic components applicable to both passive and active components.
10. Enclosed Media Printing as an Alternative to Metal Blades
The evolution of PCBs in terms of the miniaturization of assemblies, components, and ever-finer feature print patterns has not slowed, and as a result continues to present ever-increasing challenges to the makers of assembly equipment and solder paste printing technology, narrowing the process window. In this article, Michael l. Martel discusses how enclosed media print head technology has kept up to these challenges.