2015’s Most Read SMT News Items


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Sparton Acquires Hunter Technology Corporation

Sparton Corporation announced that its wholly owned subsidiary, Sparton Hunter Corporation, completed a merger with Hunter Technology Corporation in a $55 million all-cash transaction. The merger is subject to certain and conditional post-closing adjustments.

Jabil Opens Innovation Center

Strategically located in the Silicon Valley, the 100,000-square-foot Blue Sky Center features Jabil’s intelligent digital supply chain toolset called Jabil in Control, factory-of-the-future technologies, stateof-the-art IoT and rapid prototyping labs, as well as access to advanced capabilities for increasing customer collaboration and product innovation.

Scanfil Expects Growth Momentum to Continue in 2015

Scanfil expects its turnover to increase by 2–8% in 2015. More turnover is generated in the second half than in the first half of the year. The company believes that its turnover will decrease slightly in the first half of the year, and particularly in the second quarter, compared to 2014. Its operating profit before non-recurring items for 2015 is expected to be EUR 13–17 million.

Zentech Manufacturing Acquires Colonial Assembly and Design

The acquisition provides tremendous synergy with Zentech’s established customer set in the DOD and military C4ISR (Command, Control, Computers, Communications, Intelligence, Surveillance, Reconnaissance) sectors while also providing enhanced engineering, product design, circuit design, machining, over-molded cable assembly and wire harnessing capabilities to the Zentech portfolio.

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Comparing Soldering Results of ENIG and EPIG Post-steam Exposure

09/11/2019 | Jon Bengston and Richard DePoto, Uyemura International USA
Electroless nickel immersion gold (ENIG) is now a well-regarded finish used to enhance and preserve the solderability of copper circuits. Electroless palladium immersion gold (EPIG), meanwhile, is a new surface finish also for enhancing and preserving solderability—but with the advantage of eliminating electroless nickel from the deposit layer. This feature has become increasingly important with the increasing use of high-frequency PCB designs whereby nickel’s magnetic properties are detrimental.

Solder Mask Evolves into a Truly Additive Process

09/09/2019 | John Fix, Taiyo America Inc.
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Selecting the Proper Flex Coverlayer Material

09/06/2019 | Dave Lackey, American Standard Circuits
Coverlayers are polymer materials used to cover and protect the copper traces of the flex circuit product. There are a number of different options available for protecting the circuits, and they serve different design requirements in terms of cost, performance, and flexural endurance optimization. When specifying the choice, it is critical to call out not just the type of coverlayer material but also the thickness requirement. This can be very important in certain types of constructions, especially when a flex circuit will experience dynamic flexing during use.



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