2015's Most Read SMT Interviews


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Zentech’s John Vaughan on the Mil/Aero Sector: “It’s Headed Up”

I-Connect007 Publisher Barry Matties and Zentech’s John Vaughan had a chance to discuss industry concerns within the mil/aero segment at IPC APEX EXPO 2015. The two also shared thoughts on the space industry.

Ready to Hire! Blackfox Provides IPC Class 3 Training to Veterans

Read this interview with Al Dill, president and CEO of Blackfox Training Institute, for an in-depth discussion on Blackfox’s expansion plans for North America and Malaysia. Dill also describes the highly successful veteran’s training program in Longmont, Colorado.

California Congressman Mike Honda Discusses American Manufacturing

Barry Matties, Publisher of I-Connect007, sat down with Congressman Honda, who represents District 17 in the Silicon Valley, and talked with him about American manufacturing, infrastructure, education and some of the current thinking in America.

A Conversation (and Day) with Joe Fjelstad

Industry veteran Joe Fjelstad, CEO and founder of Verdant Electronics, met up with Barry Matties recently to spend a day together enjoying their conversation that ebbed and flowed between a wide variety of topics including the “war against failure.”

American Standard Circuits’ Unique Offerings Contribute to Long-term Success

At the recent IMS RF and microwave show in Arizona, Anaya Vardya, CEO of American Standard Circuits discussed the current market trends, the company’s recent equipment investments, and where ASC’s growth will likely come from.

BGA or CGA: When Is It Right for You?

This interview with TopLine president and founder Martin Hart focuses on column grid array (CGA) and how CGA can solve delamination problems. CGAs, also known as CCGA, are not necessarily new but are making a strong comeback in the high reliability market.

A Look at the High-Reliability Interconnect Market

In an interview with I-Connect007, Mark Cormier of Miraco Inc. discusses his company’s activities and capabilities, the latest trends and drivers in the high-reliability segment, and their strategies when it comes to managing their assembly work as well as their audit processes to find EMS providers.

Solder Jet Printing: Is It the Right Time?

Publisher Barry Matties gets an update from Nico Coenen, sales director for Mycronic, on their solder jet printing system. Mycronic has been developing and pioneering this technology for 10 years and they believe now is the time for it to gain real traction.

A Look at Saki’s Approach to 2D, 3D and X-ray Technology

At NEPCON 2015 we sat down with Nori Koike, COO of Saki of Japan, to discuss the latest demands for 3D and their approach to inspection. Saki has built a line-up of tools that covers the inspection spectrum.

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Excerpt—The Printed Circuit Assembler’s Guide to... SMT Inspection: Today, Tomorrow, and Beyond, Chapter 2

04/15/2021 | Brent Fischthal, Koh Young America
A limitation of many 3D optical inspection systems is the cycle time typically associated with processing millions of pixels to reconstruct a full 3D image using data captured from multiple channels. There should not be a compromise between 3D inspection and throughput. A successful inspection deployment should provide oversight for the process, not compromise, interrupt or slow that process.

Excerpt: The Printed Circuit Assembler’s Guide to... SMT Inspection: Today, Tomorrow, and Beyond, Chapter 1

04/08/2021 | Brent Fischthal, Koh Young America
Today, optical inspection systems are the preferred solution for in-line quality control in the SMT industry. Systems such as solder paste inspection (SPI) or automated optical inspection (AOI) systems for pre- and post-reflow are almost standard in every production facility.

Real Time With… Premium Sponsors Share ‘Top 5 Things You Need to Know’

03/05/2021 | I-Connect007
As part of I-Connect007’s coverage of the IPC APEX EXPO 2021, four premium sponsors share their knowledge and expertise in the following categories.



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