Mek Introduces ISO-Spector, Inline 3D Topographical & Imaging AOI


Reading time ( words)

The completely new ISO-Spector from leading AOI manufacturer Mek (Marantz Electronics), is an AOI system of 'true measurement' for the full across-the-board inspection of components and solder joints.

Unlike other methods of height measurement, ISO-Spector technology enables inspection of heights up to 30 mm (1.2"), and is practically immune to vibrations from nearby placement machines which might otherwise cause blurry images and therefore inaccurate and non-repeatable results during production. It is able to inspect the world’s smallest chip size of 008004 (50% of 01005") and features a full profile simultaneous 2D and 3D inspection while maintaining high inspection speed using patented sensor technology.

The image capturing sensor has a massive 12 Mega Pixel resolution with optical fibre interface. The ISO-Spector enables accurate height measurement by using front & rear, close to vertical, high energy, high-end violet lasers. These lasers, combined with proprietary algorithms, result in the minimization of blind spots (shadow) and the effect of reflecting objects. Warped PCB’s up to 4 mm (160 mils) are compensated for on the fly by the Z-axis and complex compensation algorithms.

Unique for these type of inspection systems, the ISO-Spector can be programmed and debugged offline using the offline programming and debugging stations.

The 3D AOI system is ergonomically designed and operated via a full touch screen.

ISO-Spector integrates fully with the FIBER system for classification, repair, traceability and SPC.

About Mek (Marantz Electronics Ltd)

A former division of Marantz well known for its high quality Audio/Video products, Mek Japan (Marantz Electronics Kabushiki Kaisha), developed its first AOI system in 1994. Developed to inspect PCB assemblies for correct component placement and soldering, the company’s original AOI system was designed for use in Marantz factories. Proving to be a highly successful, cost-effective alternative to traditional human inspection, Mek developed its first generation commercial system in 1996. With a steadily growing installed base, MEK Japan and its European/American headquarters, Mek, have sold over 5000 units worldwide to date. Now well established as a leading force in AOI technologies, the company also manufactures a 5D post-print SPI system which combines 3D and 2D image processing methodologies to deliver unprecedented defect detection. At the beginning of March 2014 the company opened US offices in Las Vegas.

Share

Print


Suggested Items

Comparing Soldering Results of ENIG and EPIG Post-steam Exposure

09/11/2019 | Jon Bengston and Richard DePoto, Uyemura International USA
Electroless nickel immersion gold (ENIG) is now a well-regarded finish used to enhance and preserve the solderability of copper circuits. Electroless palladium immersion gold (EPIG), meanwhile, is a new surface finish also for enhancing and preserving solderability—but with the advantage of eliminating electroless nickel from the deposit layer. This feature has become increasingly important with the increasing use of high-frequency PCB designs whereby nickel’s magnetic properties are detrimental.

Solder Mask Evolves into a Truly Additive Process

09/09/2019 | John Fix, Taiyo America Inc.
The 5G era is creating quite a bit of work for many PCB engineers as the materials required to keep up with the speed, frequency, and latency requirements need to be defined and qualified. Solder mask, for example, now becomes a truly additive process. Read on to find out how and why.

Selecting the Proper Flex Coverlayer Material

09/06/2019 | Dave Lackey, American Standard Circuits
Coverlayers are polymer materials used to cover and protect the copper traces of the flex circuit product. There are a number of different options available for protecting the circuits, and they serve different design requirements in terms of cost, performance, and flexural endurance optimization. When specifying the choice, it is critical to call out not just the type of coverlayer material but also the thickness requirement. This can be very important in certain types of constructions, especially when a flex circuit will experience dynamic flexing during use.



Copyright © 2019 I-Connect007. All rights reserved.