Key-Tech Electronic Systems Boosts Capabilities; Installs New Equipment


Reading time ( words)

Key-Tech Electronic Systems has announced it is further advancing its production ambitions with the recent installation of two, new, fully automated Yamaha Z:LEX YSM20 modular surface mount machines , within the busy 46,000 sq. ft. facility.

Key-Tech Electronic System’s Z:LEX YSM20, considered to be the best in its class, has operating mounting speeds of 90,000 chips per hour. With a built-in smart recognition system, reducing operator input, it can place unconventionally shaped components accurately and efficiently without compromising on quality.

In the year where Key-Tech Electronic Systems celebrates its coming of age, with a very successful 21 st anniversary, the two company directors, Jim Spence and David Weir, decided to move forward with their top end clients by purchasing not one, but two of these elite machines. The modularity of the Z:LEX YSM20 perfects Key-Tech Electronic System’s ability to deliver high speed assemblies of multi-sized components on a by-far greater scale, now enhancing customers’ demanding turnarounds. From miniaturised components [such as the 0301 5 (0.3mmx0.1 5mm) to large assemblies, Key-Tech Electronic Systems now offers the electronic and electromechanical industry a competitive and leading edge flexibility and versatility to meet the demanding requirements of today’s marketplace.

Share

Print


Suggested Items

Practical Verification of Void Reduction Method for BTC Using Exposed Via-in-pad

12/16/2019 | Alfredo Garcia, et al, Sanmina and Nokia
The method explored in this article regards the use of exposed via-in-pad. A dedicated test vehicle was designed for two types of QFN components. The main variables accounted for were the component size, number of exposed vias in the thermal pad, via pitch, via size, and solder paste coverage. The responses sought in this experiment include a thermal pad void level and solder wicking down the via barrel with resulting solder protrusion on the opposite side of the PCB.

Dispensing EMI Shielding Materials: An Alternative to Sputtering

08/23/2019 | Garrett Wong, Nordson Asymtek and Jinu Choi, Henkel Electronic Materials Llc
Shielding electronic systems against EMI has become a hot topic. Technological advancements toward 5G standards, wireless charging of mobile electronics, in-package antenna integration, and SiP adoption are driving the need to apply more effective EMI shielding and isolation to component packages and larger modules. For conformal shielding, EMI shielding materials for exterior package surfaces have mostly been applied with a PVD process of sputtering, leveraging front-end packaging technologies to back-end packaging applications.

The Role of Parylene Conformal Coatings in Next-gen Electronics

08/19/2019 | Tim Seifert, Specialty Coating Systems
Designers and manufacturers of electronics are under pressure to make packages smaller, lighter, and more environmentally friendly, while ensuring that their new technologies perform reliably in their operating environments. This article takes a closer look at Parylene conformal coatings and the role they can play in helping manufacturers address current and future challenges in the electronics industry.



Copyright © 2020 I-Connect007. All rights reserved.