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The Surface Mount Technology Association (SMTA) is inviting the industry to share their research for presentation at the 10th Annual International Conference on Soldering and Reliability (ICSR), which will be held from May 9–11, 2016 in Toronto, Canada.
For those interested in presenting, please submit a 200-300 word abstract to Jenny Ng at firstname.lastname@example.org on or before February 1, 2016. Authors will be notified of acceptance by February 15, 2016. Technical papers are required and will be due on March 21, 2016.
Suggested topics to be covered include Lead-free Assembly Processes, including Test; solder joint reliability under temp cycling, mechanical shock/drop, after aging; tin whiskers; electromigration; thermal dissipation; environmental compliance/regulations; conformal coating; manufacturing process; mechatronics; corrosion; lead free die attach soldering; and new solder paste technologies, to name few.
To submit an abstract, click here.