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The Surface Mount Technology Association (SMTA) is inviting the industry to share their research for presentation at the 10th Annual International Conference on Soldering and Reliability (ICSR), which will be held from May 9–11, 2016 in Toronto, Canada.
For those interested in presenting, please submit a 200-300 word abstract to Jenny Ng at firstname.lastname@example.org on or before February 1, 2016. Authors will be notified of acceptance by February 15, 2016. Technical papers are required and will be due on March 21, 2016.
Suggested topics to be covered include Lead-free Assembly Processes, including Test; solder joint reliability under temp cycling, mechanical shock/drop, after aging; tin whiskers; electromigration; thermal dissipation; environmental compliance/regulations; conformal coating; manufacturing process; mechatronics; corrosion; lead free die attach soldering; and new solder paste technologies, to name few.
To submit an abstract, click here.
Nolan Johnson, I-Connect007
VJ Electronix's Brennan Caissie shares the benefits of a new inspection tool that can be used on a variety of boards, with an automated system that takes the pressure off the manufacturing floor operators and can provide feedback all the way to the design process.
Barry Matties, I-Connect007
Barry Matties leads this engaging retrospective conversation with Dave Hillman, a Fellow, Materials and Process engineer at Collins Aerospace, who talks about mentorship, pandemic changes, and solder. “Soldering is soldering,” Dave says. “But how we do that keeps evolving in response to the new technologies and smaller packages.” What’s the key to his success and longevity? “Find your passion.” Here’s how he’s done it.
Patty Goldman, I-Connect007
The Dieter Bergman IPC Fellowship Award is given to individuals who have fostered a collaborative spirit, made significant contributions to standards development, and have consistently demonstrated a commitment to global standardization efforts and the electronics industry. Bev Christian is a facilitator for the High Density Packaging User Group (HDPUG) and an adjunct associate professor in the Department of Mechanical and Mechatronics Engineering of the University of Waterloo, Waterloo, Ontario, Canada. In the past 31 years he has held positions at Nortel, BlackBerry, and CALCE; all in the areas of materials and failure analysis. Bev has never missed an IPC APEX EXPO since its inception. He is a member of 27 IPC committees and attends as time and the lack of clones allow.