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The Surface Mount Technology Association (SMTA) is inviting the industry to share their research for presentation at the 10th Annual International Conference on Soldering and Reliability (ICSR), which will be held from May 9–11, 2016 in Toronto, Canada.
For those interested in presenting, please submit a 200-300 word abstract to Jenny Ng at firstname.lastname@example.org on or before February 1, 2016. Authors will be notified of acceptance by February 15, 2016. Technical papers are required and will be due on March 21, 2016.
Suggested topics to be covered include Lead-free Assembly Processes, including Test; solder joint reliability under temp cycling, mechanical shock/drop, after aging; tin whiskers; electromigration; thermal dissipation; environmental compliance/regulations; conformal coating; manufacturing process; mechatronics; corrosion; lead free die attach soldering; and new solder paste technologies, to name few.
To submit an abstract, click here.
Narahari S Pujari and Krithika PM, MacDermid Alpha Electronics Solutions
The interdigitated back contact (IBC) is one of the methods to achieve rear contact solar cell interconnection. The contact and interconnection via rear side theoretically achieve higher efficiency by moving all the front contact grids to the rear side of the device. This results in all interconnection structures being located behind the cells, which brings two main advantages. First, there is no frontside shading of the cell by the interconnection ribbons, thus eliminating the need for trading off series resistance, losses for shading losses when using larger interconnection ribbons. Second, a more homogeneous looking frontside of the solar module enhances the aesthetics.
I-Connect007 Editorial Team
Solder defects in surface-mount technology (SMT) assembly have been an issue for decades. Further, the combined challenges of Pb-free soldering and ever-increasing miniaturization have resulted in new or exacerbated defects in electronics assembly, but there are proven ways to avoid defects. This book will be especially beneficial to PCB assemblers in improving their assembly processes and the reliability of the end-product, eliminating field failures, and reducing costs.
Andy Shaughnessy, I-Connect007
At the SMTA Dallas Expo, Andy Shaughnessy sat down with Miles Moreau of KIC to discuss the company’s latest offering in wave process inspection technology. Miles also explains how KIC’s early focus on automated real-time process monitoring has enabled them to become a leader in Smart factory implementation.