Reading time ( words)
The Surface Mount Technology Association (SMTA) is inviting the industry to share their research for presentation at the 10th Annual International Conference on Soldering and Reliability (ICSR), which will be held from May 9–11, 2016 in Toronto, Canada.
For those interested in presenting, please submit a 200-300 word abstract to Jenny Ng at email@example.com on or before February 1, 2016. Authors will be notified of acceptance by February 15, 2016. Technical papers are required and will be due on March 21, 2016.
Suggested topics to be covered include Lead-free Assembly Processes, including Test; solder joint reliability under temp cycling, mechanical shock/drop, after aging; tin whiskers; electromigration; thermal dissipation; environmental compliance/regulations; conformal coating; manufacturing process; mechatronics; corrosion; lead free die attach soldering; and new solder paste technologies, to name few.
To submit an abstract, click here.
I-Connect007 Editorial Team
The San Diego sun was warm and bright on Wednesday afternoon, but it didn’t stop the crowds from filling the aisles at IPC APEX EXPO 2023 for the trade show’s second official day. Technical conferences, professional development courses, and a keynote from IPC President and CEO John W. Mitchell kept attendees busy. But the real highlight of the day was upstairs where approximately 300 high school students from the local San Diego area rode buses to the San Diego Convention Center for a day full of activities meant especially for them.
Charlene Gunter du Plessis, IPC Education Foundation
IPC has a responsibility to its current members but also in attracting and retaining new talent to the electronics manufacturing industry. This is no more evident than in the STEM event hosted by the IPC Education Foundation at IPC APEX EXPO. For the 2023 event, more than 500 students from nearly a dozen high schools are expected to participate in hands-on activities, touring the show floor, and learning from industry experts. The Career Panel Luncheon will expand across the in-person event as we broadcast and stream to schools across the United States.
Andy Shaughnessy, I-Connect007
In this Q&A, Rob Rowland, director of engineering at Axiom Electronics, discusses his new IPC APEX EXPO Professional Development course, “Reflow Profiling Simplified,” on how to create a standardized methodology to accurately generate new reflow soldering profiles. Rob explains, “In this class, I’ll explain how I approached this work to help others develop similar methodologies for creating their own reflow soldering profiles. My presentation also includes the basic reflow profile recipes I have been using for the past 20 years.”