Indium Features Heat-Spring for LED Manufacturing at Strategies in Light

Reading time ( words)

Indium_LED.jpgIndium Corporation will feature Heat-Spring, a compressible, recyclable, metal thermal interface material, at Strategies in Light on March 1-3 in Santa Clara, California.

Indium Corporation’s Heat-Spring is an interface that provides 86 W/mK of thermal conductivity using a pressure range of only 35-100+ psi.

Heat-Spring helps Avoid the Void in high-power LEDs due to its superior conductivity, ease of use, and improved performance over time as compared to thermal grease alternatives. In addition, Heat-Spring® will not bake out or pump out, thus eliminating the air voids left by inferior greases that can result in thermal failures.

Heat-Spring® is reclaimable and recyclable, and is packaged in custom trays or tape & reel.

Heat-Spring® metal thermal interface material is just one of a wide range of Indium Corporation products for the LED assembly industry – from PCB assembly to die-attach to technology-enabling TIMs – which combine superior performance with ease of placement. This reduces cost, increases first-pass yields, reduces field failures, and optimizes profits.

To learn more about on Heat-Spring, click here or visit Indium Corporation at booth 110.



Suggested Items

Oren Manor on the Siemens-Mentor Integration

11/26/2019 | Real Time with...productronica
In this video interview, part of the productronica coverage, the I-Connect007 team speaks with Oren Manor, director of business development for Siemens, in the Siemens booth. Oren introduces us to the in-booth production equipment that integrates factory automation, motion controls, and MES solutions. He points out that the recent effort to automate SMT lines is now expanding into the areas of final assembly, box build, and manual assembly as well.

Meet Zulki Khan, SMT007 Columnist

10/25/2019 | I-Connect007
Meet Zulki Khan, one of our newest SMT007 columnists! Khan’s columns address new frontiers in upcoming manufacturing techniques, including challenges in the marriage of SMT and microelectronics manufacturing and the critical aspects involved.

IPC Electronics Materials Forum 2019

10/16/2019 | IPC
IPC will be holding its Electronics Materials Forum 2019 from November 5–7, 2019, in Bloomington, Minnesota. The Electronics Materials Forum is a new technical conference focused on developments in materials and processes associated with advanced electronics assembly and manufacturing.

Copyright © 2020 I-Connect007. All rights reserved.