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Indium Corporation has expanded its family of high-performance, lead-free, low-voiding, no-clean solder pastes with the release of Indium8.9HF, a halogen-free solder paste that is specifically formulated to Avoid the Void, while delivering high transfer efficiency with low variability.
In addition to improved print transfer and response-to-pause, Indium8.9HF also provides excellent pin-in-paste solderability and hole-fill, while remaining stable at room temperature for up to 30 days.
Featuring unique oxidation barrier technology, Indium8.9HF is suitable for a variety of applications, especially automotive. This solder paste delivers robust reflow capability and a wide process window, accommodating various board sizes and throughput requirements, minimizing potential defects.
For more information about Indium8.9HF, email email@example.com or click here.
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, thermal management, and solar markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil. Founded in 1934, Indium has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.