KYZEN will Address Ways to Improve Stencil Printing Reliability at productronica China


Reading time ( words)

KYZEN announces plans to exhibit in Booth #E1.1216 at productronica China, scheduled to take place March 15-17, 2016, at the Shanghai New International Expo Centre. KYZEN will discuss recent research that points to ways to improve stencil printing reliability. The research strongly supports the need for a wet wipe with an engineered solvent that matches to the flux composition.

The evidence from the study concludes that reliable and acceptable assemblies start with a clean print. In addition, clean prints are more achievable on a reliable basis with engineered solutions, such as CYBERSOLV® C8882 than they are with standard IPA. In addition to sharing the results of the stencil reliability research findings, visitors to the KYZEN booth can acquire custom technical support to help reduce misprints and increase production yields at no cost.

CYBERSOLV® C8882 will be featured in the KYZEN booth. C8882 is a fast-acting stencil cleaning solvent designed for the under-stencil on printer wipe cleaning process. The solvent dries quickly, eliminating the streaking and smearing experienced with traditional cleaning solvents.

With more than 25 years’ experience and more than 50 industry awards, KYZEN connects leading science with care to create the most effective cleaning solutions for each customer’s unique manufacturing process or problem.

You can request the technical paper entitled, “Understencil Wipe Cleaning Yield Improvements” from the KYZEN E-Knowledge center here.

About KYZEN

KYZEN is a global leader in providing environmentally responsible, RoHS compliant precision cleaning chemistries for industries ranging from electronics and advanced packaging to metal finishing and aerospace applications. Since its founding in 1990, KYZEN’s innovative cleaning technologies, scientific expertise and customer support have been repeatedly recognized with the industry’s most prestigious awards. 

Share

Print


Suggested Items

RTW SMTAI: KYZEN's Forsythe Discusses Gap in Cleaning Knowledge

10/22/2018 | Real Time with...SMTAI
Tom Forsythe, executive vice president of KYZEN Corp., busts myths around "how-clean-is-clean." He discusses the increasing cleaning challenges as devices get more dense and form factors become even smaller, and how these trends are driving the need for cleaning and causing a gap in cleaning knowledge. He also speaks about their new products in data collection and monitoring software for cleaning equipment.

Towards a Data-Driven Cleaning Environment

09/19/2018 | Stephen Las Marias, I-Connect007
Tom Forsythe, executive vice president at KYZEN, discusses the most critical challenges of the cleaning process, a new approach to testing the cleanliness of PCB assemblies, and how KYZEN is helping customers develop a more data-driven approach to cleaning.

Why Clean?

09/17/2018 | Stephen Las Marias, I-Connect007
In our conversations, many assemblers said that cleaning is not a value add, that their customers are getting nothing out of it. It also means an added process, and as such, an additional production cost. On top of that, no-clean fluxes have been in the industry for over 20 years now. But still, why clean?



Copyright © 2019 I-Connect007. All rights reserved.