Alpha’s Corné Hoppenbrouwers to Present at the EPP Innovations Forum in Boblingen


Reading time ( words)

Alpha Assembly Solutions, the world leader in the production of electronic soldering materials, will present its high reliability solutions for Automotive Assembly Applications at the 4th EPP Innovations Forum on Thursday 10th March, in Böblingen, Germany.

Alpha’s presentation which will be given by Corné Hoppenbrouwers, Sales and Technical Support Manager for Central Europe, and will focus on solder alloys for Automotive Applications, including fatigue resistant alloys such as InnoLot for under hood applications and low silver, low temperature alloys for inside the cabin.

“Alpha’s range of high operating temperature automotive assembly solutions which use the InnoLot alloy provide stronger solder joints that can withstand the harsh operating conditions of the engine bay. For the In-Cabin area of vehicles, Alpha’s innovative SBX02 low temperature solder alloy can provide the solution to cutting down on assembly costs by enabling the use of low cost, lightweight PET flex circuitry”, comments Steve Brown, Director of Automotive OEM Marketing, Alpha Assembly Solutions.

The 4th EPP Innovations Forum will focus on high mix/low volume production, with the events main aim to transfer knowledge and improve competitiveness for electronics in Germany. The event will bring together a number of key industry professionals who will each give a 20 minute talk. There will also be breaks throughout the day for networking opportunities.

To register for the event click here.

Share

Print


Suggested Items

What’s Driving AOI Innovation and Collaboration?

03/25/2020 | Brent Fischthal, Koh Young America
When we look at the optical inspection market growth trajectory, we can see how process challenges helped create innovations. For example, solder paste inspection (SPI) has undergone a shift from 2D to 3D because the 2D inspection technologies manufacturers traditionally used to collect solder deposit images could not solve shadowing problems. Thus, companies developed 3D SPI to capture the printed solder paste height to accurately measure the total volume of paste printed. Several years later, we see the same need for surface-mounted component inspection with AOI systems.

AIM Appoints Oscar Hernandez as Sales Manager for Queretaro and Bajio Regions Mexico

03/24/2020 | AIM Solder
AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce the appointment of Oscar Hernandez to the position of Sales Manager for the Queretaro and Bajio regions of Mexico.

Trends From the Show: Solder and Software

03/18/2020 | Nolan Johnson, I-Connect007
In my role as a media representative, my perspective on IPC APEX EXPO may be a bit different from that of many attendees. Since the I-Connect007 team had the opportunity to talk to many attendees and exhibitors and listen to their stories over the course of the week, our view can be particularly wide. When I reflected on all the conversations, pieces from all throughout the week coalesced and provided a different understanding of and takeaway from the show.



Copyright © 2020 I-Connect007. All rights reserved.