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AIM Solder will highlight its revolutionary M8 No Clean Solder Paste, along with its full line of solder assembly materials at the upcoming IPC APEX EXPO 2016 trade show, which is scheduled to take place from March 15–17 at the Las Vegas Convention Center in Las Vegas, Nevada. AIM will be at booth in 3100.
AIM's M8 has been formulated to address the most demanding requirements confronting today's SMT assembly market. M8 is proven to improve production yields and product quality, whether printing 0.50 area ratios or eliminating voiding on QFN and LED packages. M8's post-reflow residue passes all IPC, BONO and tough changing environment test specifications, making it the ideal choice for automotive and high performance/high reliability applications. M8's robust characteristics and stable performance improves every facet of the PCB assembly process.
Headquartered in Montreal, Canada, AIM Solder is a leading global manufacturer of assembly materials for the electronics industry with manufacturing, distribution and support facilities located throughout the world. AIM produces advanced solder products such as solder paste, liquid flux, cored wire, bar solder, epoxies, lead-free and halogen-free solder products, preforms, and specialty alloys such as indium and gold for a broad range of industries. A recipient of many prestigious SMT industry awards, AIM is strongly committed to innovative research and development of product and process improvement as well as providing customers with superior technical support, service and training. For more information about AIM, click here.