New Paradigms

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The year 2015 saw many technology milestones reached and challenges overcome as R&D became more cutting edge. From high-performance sensors to 3D printing, automotive electronics, wearables, virtual reality and robotics, innovations abound in all technology sectors, helping improve almost every facet of our lives. Last month's CES 2016 exhibition showcased these latest and emerging technologies, and provided a glimpse of how the future will look.

In its recent whitepaper, market analyst IHS listed key technology segments to watch out for this year, which it expects will bring the global technology industry to even greater heights in 2016. Among these sectors are thinner, lighter and more flexible displays; ultrasonic sensors; data mining and predictive analytics; medical technology; connected home; automotive intelligence; and solar power.

While all of these developments bode well for the electronics manufacturing industry, they also offer many challenges in terms of the way they are being manufactured. The trend toward smaller, lighter, faster, lower-power and cheaper devices continues to put a strain on equipment and production processes, and remains top priority for electronics designers and manufacturers.

This leads me to this issue of SMT Magazine, which features "what's new" in the electronics manufacturing and assembly industry from a business and technology standpoint.

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Editor's Note: This article originally appeared in the February 2016 issue of SMT Magazine.

01/05/2018 | Stephen Las Marias, I-Connect007

It seems like it wasn't too long ago when I was writing about the optimism of the electronics manufacturing and assembly industry going into 2017. Now, here we are again at the beginning of the new year, looking at new trends, disruptive technologies, and emerging markets for 2018. I am also proud to announce our new branding as well as our fresh, new look.

08/23/2016 | Stephen Las Marias, I-Connect007

In the latest issue of SMT Magazine, we take a pause from covering the latest technology trends, challenges, and solutions in the electronics manufacturing and assembly industry. Instead, we are focusing on our readers—to give a voice to their thoughts on the industry, companies, jobs, interests, and even pain points when it comes to their respective specialties.

07/05/2016 | Stephen Las Marias, I-Connect007

In our recent survey on PCBA test and inspection challenges, respondents consider the following to be among their biggest problems: probing to narrower traces and pads; testing boards with smaller and finer features and sizes; dry solder and other solder-related issues; finding sublayer defects; dealing with flat, no-lead components; and testing cycle time. This month, we look into different PCBA test and inspection strategies that address the key challenges in today’s electronics manufacturing and assembly environment.