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NASA, Italian Space Agency Join Forces on Air Pollution Mission

03/13/2023 | NASA JPL
NASA and the Italian space agency Agenzia Spaziale Italiana (ASI) are partnering to build and launch the Multi-Angle Imager for Aerosols (MAIA) mission, an effort to investigate the health impacts of tiny airborne particles polluting some of the world’s most populous cities.

Trouble in Your Tank: Revisiting the Art and Science of Photoresist Stripping

01/09/2023 | Michael Carano -- Column: Trouble in Your Tank
As circuits become more compact, circuit lines and the spaces between them are becoming finer. As the distances between these lines decrease, copper over-plating is more likely to have a deleterious effect on photoresist stripping, which can lead to shorts on costly fine-line PCBs. PCB designers, for example, must attempt to squeeze increasingly more amounts of information onto a smaller board. In practical terms, this means that circuits are becoming more compact; circuit lines and the spaces between them are becoming finer. As the distances between these lines decrease, copper overplating is more likely to have a deleterious effect on photoresist stripping.

Keio University Research: Eco-friendly Nanoparticles for Batteries

10/24/2022 | PRNewswire
Keio University researchers report in the journal Nano Select on innovative technology enabling silicon waste to be recycled into battery anode materials by means of an efficient, sustainable method utilizing laser irradiation.

CyberOptics to Feature Yield-Improving Auto Teaching Systems During SEMICON Europa

10/07/2022 | CyberOptics Corporation
CyberOptics Corporation, a leading global developer and manufacturer of high-precision 3D sensing technology solutions, will exhibit at SEMICON Europa 2022, scheduled to take place November 15-18, 2022 at the Messe Munchen in Munich, Germany.

Happy’s Tech Talk #12: Nano-Cu Paste for Microvias

10/10/2022 | Happy Holden -- Column: Happy’s Tech Talk
Complex build-up HDI technologies continue to expand in applications. Copper electroplating of vias has been perfected but the process is yet another electroplating solution to maintain and can sometimes be a lengthy process. Current conductive paste fills are not as conductive as solid copper but provide reduced cycle time, are still highly conductive and are cost effective.
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