KYZEN to Present New Research on Solder Paste Release at the SMTA China East Vendor Conference


Reading time ( words)

KYZEN today announced that Daniel Gao, Sales Manager – Northern China, will present during the SMTA China East Vendor Conference, during NEPCON China, scheduled to take place April 26-28, 2016 at the Shanghai World EXPO Exhibition & Convention Center. Gao will present the paper authored by Chrys Shea, Shea Engineering Services, Mike Bixenman, DBA, KYZEN, and Ray Whittier, Vicor Corporation, entitled, “Video Analysis of Solder Paste Release from Stencils.”

Gao will discuss why solder paste release from the stencil is a critical factor in print quality, and ultimately, overall electronic product quality and reliability. He will delve into the experiment devised to better understand release mechanics using a video microscope to capture the separation of the stencil from the PCB.  The experiment incorporates different aperture area ratios, solder pastes, stencil nano-coatings and under wipe solvents to visualize their effects on paste release.

This study builds on previous research that developed the test setup and recording methods, and incorporates some modifications to the original experimental configuration to improve image quality. The outputs of the experiments are videos that demonstrate the effects of solder paste formulation, solvent under wiping and nano-coating on paste release at different area ratios. The paper will discuss the observations from the videos, and the presentation will play the videos.

Based in BeiJing, Gao more than 10 years of experience in semiconductor applications and electronic assemblies including wafer bumping processes, flip Chip packaging, LED packaging and PCB assembly applications. Gao has worked for KYZEN for more than six years, responsible for sales, marketing and customer technical support, cooperating with solder paste and cleaning machine suppliers in Northern China.

About KYZEN

KYZEN is a global leader in providing environmentally responsible, RoHS compliant precision cleaning chemistries for industries ranging from electronics and advanced packaging to metal finishing and aerospace applications. Since its founding in 1990, KYZEN’s innovative cleaning technologies, scientific expertise and customer support have been repeatedly recognized with the industry’s most prestigious awards. For more information, visit www.kyzen.com.

Share

Print


Suggested Items

What’s Driving AOI Innovation and Collaboration?

03/25/2020 | Brent Fischthal, Koh Young America
When we look at the optical inspection market growth trajectory, we can see how process challenges helped create innovations. For example, solder paste inspection (SPI) has undergone a shift from 2D to 3D because the 2D inspection technologies manufacturers traditionally used to collect solder deposit images could not solve shadowing problems. Thus, companies developed 3D SPI to capture the printed solder paste height to accurately measure the total volume of paste printed. Several years later, we see the same need for surface-mounted component inspection with AOI systems.

AIM Appoints Oscar Hernandez as Sales Manager for Queretaro and Bajio Regions Mexico

03/24/2020 | AIM Solder
AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce the appointment of Oscar Hernandez to the position of Sales Manager for the Queretaro and Bajio regions of Mexico.

Trends From the Show: Solder and Software

03/18/2020 | Nolan Johnson, I-Connect007
In my role as a media representative, my perspective on IPC APEX EXPO may be a bit different from that of many attendees. Since the I-Connect007 team had the opportunity to talk to many attendees and exhibitors and listen to their stories over the course of the week, our view can be particularly wide. When I reflected on all the conversations, pieces from all throughout the week coalesced and provided a different understanding of and takeaway from the show.



Copyright © 2020 I-Connect007. All rights reserved.