AIM’s Dillon Zhu to Present White Paper at SMTA China East Technical Conference

Reading time ( words)

AIM Solder's Regional Technical Support Manager Dillon Zhu will present the second installment of the “Conformal Coating Over No Clean” paper by Karl Seelig, Vice President of Technology and Timothy O’Neill, Technical Marketing Manager, at the SMTA China East Technical Conference. The conference will take place from April 26–27, 2016 at the Shanghai World Expo Exhibition & Convention Center in Shanghai, China.

The need to increase package density and reduce costs has led to the rapid deployment of leadless packages such as QFN, POP, LGA, and Micro-BGA.  In many cases, the manufacturers of these devices will mandate the use of no clean fluxes, due to concerns over the ability to consistently remove flux residues from under and around these low stand-off devices.  These concerns have led to the challenge of applying conformal coating over no clean residues. In this study, AIM’s Research & Development Department paired with electronics manufacturers and conformal coating manufacturers in an attempt to characterize the different coating technologies currently available.

On April 27, 2016, in room No. 5, B1, from 3:50pm to 4:25pm (15:50 – 16:25), Dillon Zhu will discuss the various coating materials that were tested with different chemistries of no clean fluxes, revealing possible combinations meeting the mission profile of the assembly with consideration for the assemblers’ capabilities and cost objectives.

About AIM

Headquartered in Montreal, Canada, AIM Solder is a leading global manufacturer of assembly materials for the electronics industry with manufacturing, distribution and support facilities located throughout the world. AIM produces advanced solder products such as solder paste, liquid flux, cored wire, bar solder, epoxies, lead-free and halogen-free solder products, preforms, and specialty alloys such as indium and gold for a broad range of industries. A recipient of many prestigious SMT industry awards, AIM is strongly committed to innovative research and development of product and process improvement as well as providing customers with superior technical support, service and training. 

For more information about AIM, click here.



Suggested Items

What’s Driving AOI Innovation and Collaboration?

03/25/2020 | Brent Fischthal, Koh Young America
When we look at the optical inspection market growth trajectory, we can see how process challenges helped create innovations. For example, solder paste inspection (SPI) has undergone a shift from 2D to 3D because the 2D inspection technologies manufacturers traditionally used to collect solder deposit images could not solve shadowing problems. Thus, companies developed 3D SPI to capture the printed solder paste height to accurately measure the total volume of paste printed. Several years later, we see the same need for surface-mounted component inspection with AOI systems.

AIM Appoints Oscar Hernandez as Sales Manager for Queretaro and Bajio Regions Mexico

03/24/2020 | AIM Solder
AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce the appointment of Oscar Hernandez to the position of Sales Manager for the Queretaro and Bajio regions of Mexico.

Trends From the Show: Solder and Software

03/18/2020 | Nolan Johnson, I-Connect007
In my role as a media representative, my perspective on IPC APEX EXPO may be a bit different from that of many attendees. Since the I-Connect007 team had the opportunity to talk to many attendees and exhibitors and listen to their stories over the course of the week, our view can be particularly wide. When I reflected on all the conversations, pieces from all throughout the week coalesced and provided a different understanding of and takeaway from the show.

Copyright © 2020 I-Connect007. All rights reserved.