Alpha Presents Technical Papers at SMTA China East Technical Conference 2016

Reading time ( words)

Alpha Assembly Solutions will present two technical papers “The Effect of Solder Paste Reflow Conditions on Surface Insulation Resistance” and “Characterization and Optimization of Board Warpage for Linear LED Lighting Assemblies” at SMTA China East Technical Conference 2016 in Shanghai, China.

The first paper is “The Effect of Solder Paste Reflow Conditions on Surface Insulation Resistance”. As known, electrochemical reliability is a fundamental requirement for every circuit assembly. Surface insulation resistance is a globally accepted standard for predicting the electrochemical reliability of printed circuits.  Therefore, this paper will attempt to measure how the reflow profile used in an SMT process affects the electrical reliability of three no-clean solder paste residues.

The second paper is “Characterization and Optimization of Board Warpage for Linear LED Lighting Assemblies”. Board warpage in fiber-glass epoxy laminate boards known as “FR” boards, is familiar phenomenon seen in traditional electronics manufacturing. The growth of the LED general lighting market has propelled the usage of high-aspect ratio boards where the length is significantly greater than the width FR type boards for a variety of applications. A significant percentage of these boards are adopted for linear lighting applications where warpage of the PCBs is most commonly seen. This paper will present a structured study to characterize the effect of warpage “bow” driven by different assembly process conditions on FR circuit boards with two dissimilar glass-transition properties designed as high aspect ratio linear lighting strips.

For more information on Alpha’s vast product offering and capabilities, visit

SMTA China East Technology Conference

Date:    April 26 -27, 2016

Venue: Shanghai World Expo Exhibition & Convention Center, Shanghai, China

Presentation: Tuesday, April 26th / 11:05am-11;40am in Room No. 6-B1

Topic:   The Effect of Solder Paste Reflow Conditions on Surface Insulation Resistance

Speaker: William Yu – Alpha Assembly Solutions

Presentation: Wednesday, April 27th / 11:40am-12:15noon in Room No. 5-B1

Topic: Characterization and Optimization of Board Warpage for Linear LED Lighting Assemblies

Speaker: William Yu – Alpha Assembly Solutions

Speaker Biography

William Yu is the Technical Service Manager for Alpha and his key responsibilities includes provision of technical and applications support, and providing advice & recommendations to a vast array of customers in mainland China. He is a member of IPC SPVC China. William joined Alpha N-China in June 2004 as a Customer Technical Service (CTS) engineer and became CTS manager in 2005. William has been at the forefront of Alpha' representation in key technical seminars and training sessions in N-China area and has more than 10 years of experience in the SMT Industry.

About Alpha Assembly Solutions

Alpha Assembly Solutions, a MacDermid Performance Solutions Business, is the global leader in the development, manufacturing and sales of innovative specialty materials used in a wide range of industry segments, including electronics assembly, power electronics, die attach, LED lighting, photovoltaics, semiconductor packaging, automotive and others.

With a unique global presence in over 30 locations throughout the Asia Pacific, Americas and Europe regions, Alpha supplies a full line of ALPHA® electronics assembly material products, including Solder Paste, Exactalloy® Solder Preforms, Cored Solder Wire Solder, Wave Soldering Fluxes, Bar Solder Alloys, and Stencils.  It offers die attach product technologies to the power electronics segment in its Argomax®, Atrox™ and Fortibond™ brands.

For the LED segment, Alpha offers its Lumet™ products covering applications from die attach to systems assembly in the LED manufacturing process.  Alpha also offers product technologies for the Photovoltaic segment, including high performance liquid fluxes and solder alloys for producing standard ribbon and bus bar, as well as, solder pastes, cored wire, conductive adhesives and preforms for use in PV module assembly. Also, Alpha’s Advanced Materials unit is the leader in electronic polymers and solder materials for semiconductor packaging applications. 

Since its founding in 1872, Alpha has been committed to developing and manufacturing the highest quality specialty materials.  For more information, click here.



Suggested Items

Solder Paste Printing From the Stencil’s Perspective

02/19/2020 | I-Connect007 Editorial Team
Jeff Schake of ASM Assembly Systems discusses the complications surrounding printing and solder paste that he sees from his perspective as a stencil expert.

Blackfox Trains Veterans for Good Manufacturing Jobs

02/18/2020 | Real Time with...IPC
Blackfox Training Institute has been training manufacturing technologists for over 20 years. Based in Longmont, Colorado, Blackfox is now focused on helping veterans of our armed services transition into good jobs in the manufacturing sector. During IPC APEX EXPO 2020, Editor Nolan Johnson spoke with Blackfox CEO Al Dill about the company's veteran training programs, and how this effort is helping companies fill jobs that might otherwise go unfilled.

Solder in PCBA: Can’t Live Without It... or Can We?

02/17/2020 | Joe Fjelstad, Verdant Electronics
For most of its historical use in electronics, the solder alloy of choice was tin-lead, either an Sn60/Pb40 alloy or the Sn63/ Pb37 eutectic version of the tin-lead alloy. These two alloys were the workhorses of the industry. They were both well understood in terms of their processing and reliability—that is, until the advent of lead-free, a well-meaning but ill-conceived and poorly executed conversion, forced on the industry by the European Union in 2006.

Copyright © 2020 I-Connect007. All rights reserved.