Super Dry to Showcase Dry Storage at West Penn SMTA with Murray Percival Co.


Reading time ( words)

Midwest electronics supplier The Murray Percival Company will feature Super Dry desiccant cabinets and moisture management solutions at this year’s SMTA Vendor Expo on May 5 in Monroeville, PA.

The continuing miniaturization of electronics, including thinner components and new materials has made the management and treatment of moisture sensitivity an increasingly critical element of electronics product reliability.  Manufacturers are being challenged to manage larger and larger volumes of parts in a controlled and traceable manner.

The Murray Percival Company will be on hand at the Doubletree to explain to visitors how low humidity desiccant cabinets not only safely store components, but can also remove moisture and reset component floor life, while providing oxidation prevention equivalent to nitrogen at a fraction of the cost.

 

Share

Print


Suggested Items

LPKF on Stencils and Depaneling

02/11/2020 | I-Connect007 Editorial Team
Stephan Schmidt and Mirela Orlowski of LPKF Laser & Electronics North America discuss laser technology in cutting stencils and depaneling circuit boards as a factor in shrinking component sizes and why few people in the industry realize how much of an impact the stencil can have on the manufacturing line.

Practical Verification of Void Reduction Method for BTC Using Exposed Via-in-pad

12/16/2019 | Alfredo Garcia, et al, Sanmina and Nokia
The method explored in this article regards the use of exposed via-in-pad. A dedicated test vehicle was designed for two types of QFN components. The main variables accounted for were the component size, number of exposed vias in the thermal pad, via pitch, via size, and solder paste coverage. The responses sought in this experiment include a thermal pad void level and solder wicking down the via barrel with resulting solder protrusion on the opposite side of the PCB.

Dispensing EMI Shielding Materials: An Alternative to Sputtering

08/23/2019 | Garrett Wong, Nordson Asymtek and Jinu Choi, Henkel Electronic Materials Llc
Shielding electronic systems against EMI has become a hot topic. Technological advancements toward 5G standards, wireless charging of mobile electronics, in-package antenna integration, and SiP adoption are driving the need to apply more effective EMI shielding and isolation to component packages and larger modules. For conformal shielding, EMI shielding materials for exterior package surfaces have mostly been applied with a PVD process of sputtering, leveraging front-end packaging technologies to back-end packaging applications.



Copyright © 2020 I-Connect007. All rights reserved.