Strategies to Reduce Handling Errors


Reading time ( words)

Despite the advancement in manufacturing technologies, processes in assembly lines continue to involve multiple opportunities for errors or defects to happen. Sometimes, these processes involve factory workers doing repetitive, dull tasks that do not add much value into the overall productivity of the company. More often than not, such causes of errors also involve out-of-date or legacy equipment that electronics manufacturers are hesitant to replace, as doing so entails a significant investment.

Nowadays, the electronics assembly industry is looking more and more into automating their production lines as automation offers several benefits, including a return on investment in the long run; reduced variation; and higher reliability. In our recent survey, the majority of respondents said automation helps them reduce handling errors—or operator errors—in their processes. It also enables faster throughput, as well as reduces the number of processing steps.

However, many companies cannot afford to acquire new and more advanced equipment just to say they are automated. There are many alternative strategies to help assemblers improve their process and reduce errors along the way.

This month's issue of SMT Magazine features other aspects of the assembly line where improvements can be made to increase the efficiency of the process.

Read The Current Issue of SMT Magazine Here

Share

Print


Suggested Items

Focus on the New

01/05/2018 | Stephen Las Marias, I-Connect007
It seems like it wasn't too long ago when I was writing about the optimism of the electronics manufacturing and assembly industry going into 2017. Now, here we are again at the beginning of the new year, looking at new trends, disruptive technologies, and emerging markets for 2018. I am also proud to announce our new branding as well as our fresh, new look.

The Industry Speaks

08/23/2016 | Stephen Las Marias, I-Connect007
In the latest issue of SMT Magazine, we take a pause from covering the latest technology trends, challenges, and solutions in the electronics manufacturing and assembly industry. Instead, we are focusing on our readers—to give a voice to their thoughts on the industry, companies, jobs, interests, and even pain points when it comes to their respective specialties.

Improving Test and Inspection

07/05/2016 | Stephen Las Marias, I-Connect007
In our recent survey on PCBA test and inspection challenges, respondents consider the following to be among their biggest problems: probing to narrower traces and pads; testing boards with smaller and finer features and sizes; dry solder and other solder-related issues; finding sublayer defects; dealing with flat, no-lead components; and testing cycle time. This month, we look into different PCBA test and inspection strategies that address the key challenges in today’s electronics manufacturing and assembly environment.



Copyright © 2019 I-Connect007. All rights reserved.