ITW EAE's MPM Edison Printer Wins VA Excellent Award at SMT China Vision Awards

Reading time ( words)

ITW EAE’s recently-introduced MPM Edison Printer earned a coveted VA Excellent Award from the SMT China Vision Awards at the recent NEPCON China exposition and conference in Shanghai. The award was presented at the SMT China Vision Awards Presentation Ceremony, during NEPCON China, Shanghai, April 26, 2016. 

The MPM Edison is an innovative new platform of next-generation printers sharing software, controls, and advanced technologies on a scalable platform. The Edison operates at twice the speed and 25% higher accuracy than current printers, and delivers an unheard-of throughput of 15 seconds, including printing and stencil wipe cycle.  The printer features built-in 8 micron alignment, and 15 micron wet print repeatability (>2 Cpk @ 6σ) proven through 3rd party Print Capability Analysis (PCA) testing. 

The annual SMT China Vision Awards program recognizes the people and products within the surface mount industry that serve as benchmarks of excellence. Products nominated are judged by a panel of well-known SMT experts and senior executives from downstream industry in China. Judging criteria focuses on Creativity and the Advanced Nature of the entries, and their contributions to the downstream industry to reduce Costs, improve Quality, increase Efficiency, enhance Reliability, and ensure Safety and protect the Environment.


ITW Electronics Assembly Equipment Group (a division of Illinois Tool Works, Inc., is the global leader in process knowledge, services and manufacture of capital equipment used in the printed circuit board assembly and semiconductor industries. The group brings together world-class products from Speedline, Vitronics Soltec and Despatch.  



Suggested Items

Congratulations to Steve Pudles! IPC Hall of Fame 2020 Inductee

02/20/2020 | Patty Goldman, I-Connect007
With over 32 years spent working with IPC, Steve Pudles was elected to the IPC’s Hall of Fame this year. Patty Goldman spoke with Steve about how he first became involved as well as his time in the organization, including his work with the EMS Management Council.

Solder in PCBA: Can’t Live Without It... or Can We?

02/17/2020 | Joe Fjelstad, Verdant Electronics
For most of its historical use in electronics, the solder alloy of choice was tin-lead, either an Sn60/Pb40 alloy or the Sn63/ Pb37 eutectic version of the tin-lead alloy. These two alloys were the workhorses of the industry. They were both well understood in terms of their processing and reliability—that is, until the advent of lead-free, a well-meaning but ill-conceived and poorly executed conversion, forced on the industry by the European Union in 2006.

True or False: CFX Edition

02/06/2020 | David Bergman, vice president, Standards and Training, IPC
Early in 2019, IPC published IPC-2591— Connected Factory Exchange (CFX), Version 1.0. This standard was developed by the IPC Connected Factory Initiative Subcommittee over a two-year period to address issues with machine-to-machine communication and provide the electronics manufacturing industry with a true plug-and-play system for any company to achieve Industry 4.0.

Copyright © 2020 I-Connect007. All rights reserved.