Salcomp Expands Manufacturing Capacity in India

Reading time ( words)

Salcomp has decided to set up its second Indian factory in the Noida City, close to Delhi. There are three main drivers for expanding manufacturing capacity in India. First, India has become one of the world’s fastest growing smartphone markets. Second, it is important to be close to customers, and following the introduction of import duties on mobile phones and tablets in 2015, many of Salcomp’s existing and potential new customers set up manufacturing operations in Northern India. Third, setting up a new domestic tariff area unit optimizes import duties now that new regulation is effective also for mobile phone components such as chargers, battery packs and headsets.

 “I am pleased to announce that the lease agreement has now been signed for a new factory in Noida. The target is to ramp up the production during coming three months. When the new Noida factory is fully operational, it can produce up to 100 million chargers per annum,” said Markku Hangasjärvi, president and CEO of Salcomp.

Salcomp’s first Indian factory in Chennai will focus on manufacturing chargers for exports as well as charger related components for the Noida plant and Salcomp's plants in China and Brazil. The new Noida plant will focus on manufacturing chargers and other products for the India domestic market. With expanded footprint in India, Salcomp is well-positioned to expand its business scope also to other mobile phone peripherals such as battery packs, headsets and data cables. 

To better service to India based mobile phone manufacturers, Salcomp is also launching four new charger platforms: Yash (5V/1A), Crater (5V/1A), Shakti (5V/2A) and Sher (5V/9V/2A fast charger).  


Suggested Items

Book Excerpt: 'The Printed Circuit Assembler’s Guide to… Solder Defects'

06/07/2022 | I-Connect007 Editorial Team
Solder defects in surface-mount technology (SMT) assembly have been an issue for decades. Further, the combined challenges of Pb-free soldering and ever-increasing miniaturization have resulted in new or exacerbated defects in electronics assembly, but there are proven ways to avoid defects. This book will be especially beneficial to PCB assemblers in improving their assembly processes and the reliability of the end-product, eliminating field failures, and reducing costs.

José Servin Receives IPC Dieter Bergman Fellowship Award

03/23/2022 | Patty Goldman, I-Connect007
The Dieter Bergman IPC Fellowship Award is given to individuals who have fostered a collaborative spirit, made significant contributions to standards development, and have consistently demonstrated a commitment to global standardization efforts and the electronics industry. José Servin has worked as an IPC member for more than 14 years in the development of the Electronics Assembly Norms. As a member of the IPC A-610 and J STD-001 working groups, he became chairman of IPC A-610G and J STD-001G Automotive Addendums that complements the norms for automotive industry since 2018.

Going Global: Bridging Today's Labor Gap

03/18/2022 | I-Connect007 Editorial Team
No doubt you will relate to Foad Ghalili when he expresses his concerns about rising input costs to doing business, from getting the right components, to delivery times, and price increases. But what’s unique for the president of Epoch International is the way his company has leveraged its U.S. and China operations to make the most of the other thing on everyone’s mind—the labor shortage. If you’re not already implementing his ideas, you will walk away from this interview with some sure-fire tips.

Copyright © 2022 I-Connect007. All rights reserved.