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Alpha Assembly Solutions, the world leader in the production of electronic soldering and bonding materials, is participating in the upcoming SMTA Philadelphia Expo & Tech Forum on June 9 in King of Prussia, Pennsylvania as both an exhibitor and technical presenter.
A presentation on "Divergence in Test Results Using IPC Standard SIR and Ionic Contamination Measurements" will be given by Jason Fullerton, Customer Technical Support Engineer for Alpha Assembly Solutions. Among the topics covered, Fullerton will compare and contrast the standard IPC test methods to characterize electrochemical reliability and ionic contamination levels.
“Many users of no-clean solder pastes treat ROSE (Resistance of Solvent Extract) testing as suitable to ascertain whether or not flux residues will be detrimental to the long-term reliability of printed circuit assemblies,” said Fullerton. “However, when compared to SIR (Surface Insulation Resistance) testing, the results of ROSE tests can be shown to provide different results than SIR on the same materials.”
In addition, Alpha's exhibit will showcase their innovative materials and solutions for the electronics assembly industry with particular focus on ALPHA Solder Paste & Preforms for Optimized Process Solutions and ALPHA Wave Solder Alloy & Chemistries and Cored Solder Wire for Optimal Performance.