Indium’s Sehar Samiappan to Present at Northern California Reliability Workshop


Reading time ( words)

Indium Corporation’s Sehar Samiappan, Regional Manager for Northern California, will present Voiding and Undried Flux Control with Bottom-Terminated Components at the Northern California Reliability Workshop on June 9 in Milpitas, California.

This presentation will detail how the use of solder preforms as venting channels for flux vaporization on bottom-terminated components can prevent wet flux conditions and significantly reduce voiding.

Samiappan is responsible for coordinating all sales and technical activities for Indium Corporation’s full product line, including solder paste, solder preforms, fluxes, thermal interface materials, and die-attach materials throughout northern California.

Samiappan joined Indium Corporation in 2001 and has served in a variety of positions, including providing field technical support, product training and troubleshooting, and assisting with customer evaluations and DOEs. He has more than 18 years of experience. Samiappan is an SMTA-certified process engineer and  has earned his Six Sigma Green Belt.

About Indium Corporation

Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, solar, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.

Share

Print


Suggested Items

Blackfox Trains Veterans for Good Manufacturing Jobs

02/18/2020 | Real Time with...IPC
Blackfox Training Institute has been training manufacturing technologists for over 20 years. Based in Longmont, Colorado, Blackfox is now focused on helping veterans of our armed services transition into good jobs in the manufacturing sector. During IPC APEX EXPO 2020, Editor Nolan Johnson spoke with Blackfox CEO Al Dill about the company's veteran training programs, and how this effort is helping companies fill jobs that might otherwise go unfilled.

Solder in PCBA: Can’t Live Without It... or Can We?

02/17/2020 | Joe Fjelstad, Verdant Electronics
For most of its historical use in electronics, the solder alloy of choice was tin-lead, either an Sn60/Pb40 alloy or the Sn63/ Pb37 eutectic version of the tin-lead alloy. These two alloys were the workhorses of the industry. They were both well understood in terms of their processing and reliability—that is, until the advent of lead-free, a well-meaning but ill-conceived and poorly executed conversion, forced on the industry by the European Union in 2006.

IPC APEX EXPO 2020 Attendees Speak: Dr. Martin Anselm

02/14/2020 | I-Connect007 Editorial Team
"The biggest challenge I’ve encountered a number of different times is the migration to much larger packaging," said Dr. Martin Anselm, director of CEMA Lab. "Devices are getting much larger, and with the thousands of I/O of solder joints, and they are not just single-die, multi-chip modules in different forms or 2.5D technologies.



Copyright © 2020 I-Connect007. All rights reserved.