-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueBox Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
Boost Your Sales
Every part of your business can be evaluated as a process, including your sales funnel. Optimizing your selling process requires a coordinated effort between marketing and sales. In this issue, industry experts in marketing and sales offer their best advice on how to boost your sales efforts.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
Selecting a Selective Soldering System, Part 2
May 30, 2016 | Robert Voigt, DDM NovastarEstimated reading time: 1 minute
Our last chapter began a discussion of selective soldering, including how it works, some pros and cons, and several fluxing and soldering options to choose from. In this chapter, we’ll dive a little deeper into the mechanics of fluxing systems.
Flux Materials
As covered in prior chapters on wave soldering, there are a variety of flux types and chemistries available, including low pH, high-solids content, and water soluble, alcohol-based, and others. Selection of a particular type of flux is frequently not an option for the contract manufacturer, since it is usually determined by the end-user’s application, so they must be able to accommodate work using many types of flux.
No-clean fluxes are generally preferred because they require little to no post-solder cleaning, except for a visible residue that should be removed. If the user opts not to use a no-clean flux, it is very important to control the amount of flux applied to the board. In most cases, controlling the solder head to cover the area previously sprayed will burn off the flux and eliminate the necessity of cleaning the residue in a subsequent step.
Remember that solder types used for selective must be compatible with solder used on the top of the board, and this will likely have a material effect on the flux type used.
Spray Fluxing
Through-hole penetration is the ultimate goal of any fluxing system, but there are a number of factors that affect the performance of a spray fluxing system.
Editor's Note: This article originally appeared in the May 2016 issue of SMT Magazine.
Suggested Items
How to Specify a Custom Machine
09/16/2016 | Robert Voigt, DDM NovastarLet’s say you have an unusual product configuration, a unique space requirement, an unorthodox handling system, or an application totally unrelated to the PCB or SMT assembly business, and you can’t find a standard machine provider that can handle your requirements. What then? This article highlights key points to consider when going the custom machine way for your project.
DDM Novastar Schedules Fall Technical Workshop
08/22/2016 | DDM Novastar Inc.DDM Novastar will be holding a technical workshop on the fundamentals of paste, place and reflow, to be held from September 14–15, 2016 at the company’s facility in Pennsylvania, U.S.A.
DDM Novastar Delivers Custom Pick-and-Place Machine
08/16/2016 | DDM Novastar Inc.DDM Novastar has shipped a custom pick-and-place machine to a large multinational laser cutting tool manufacturer.
Selecting a Selective Soldering System, Part 5
08/08/2016 | Robert Voigt, DDM NovastarFor the conclusion of his series on selective soldering discussion, Robert Voigt does a quick wrap-up to remind potential buyers about some important considerations that affect the purchase decisions they make.
Improving Test and Inspection
07/05/2016 | Stephen Las Marias, I-Connect007In our recent survey on PCBA test and inspection challenges, respondents consider the following to be among their biggest problems: probing to narrower traces and pads; testing boards with smaller and finer features and sizes; dry solder and other solder-related issues; finding sublayer defects; dealing with flat, no-lead components; and testing cycle time. This month, we look into different PCBA test and inspection strategies that address the key challenges in today’s electronics manufacturing and assembly environment.