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Shenmao America Inc. will feature its new Sn-3.0Ag-0.5Cu lead-free solder paste PF606-P133H for laser soldering applications at the upcoming IEEE Electronic Components and Technology Conference 2016 event, which will be held from June 1–2 at The Cosmopolitan of Las Vegas, in Las Vegas, Nevada.
Dispensed from syringes, the PF606-P133H is developed for automatic laser soldering processes in the packaging and assembly of surface mount devices and microelectronics. Laser energy is applied at the precise location in a non-contact procedure to create high shear strength well-formed solder joints during the lower thermal stress process while reducing intermetallic formation.
The PF606-P133H solder paste produces minimal flux residue and no-splash or solder balling issues. It is well suited for high yield soldering of sensitive electronic components in manufacturing or repair of electronic devices that can not tolerate conventional reflow-oven temperature.