June 2016 Issue of SMT Magazine Available Now

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Solder Paste Printing: Challenges and Solutions—The June 2016 issue of SMT Magazine discusses the challenges, best practices, and critical factors to consider in solder paste printing amid tighter tolerances and smaller pitches, lines and spaces.

Read the June issue of SMT Magazine, now on the virtual newsstand and available for delivery in your e-mailbox by subscribing here.

08/01/2018 | Patty Goldman, I-Connect007

I-Connect007's Patty Goldman caught up with Juki Automation’s Bill Astle during a luncheon on the last day of IMPACT Washington D.C., 2018. As a first-time attendee, Bill came away feeling like he made the right connections with key members of Congress, and he looks forward to returning to the event in the future.

07/05/2018 | Happy Holden, I-Connect007

In May, I took the opportunity to drive around Lake Michigan and visit the SMTA Milwaukee Chapter’s Wisconsin Expo & Tech Forum. Held at the Crowne Plaza Milwaukee Airport Hotel, this was a well-organized and attended table-top expo and technical forum, with over 60 exhibitors, and a high school team with their FIRST Robotics entry.

06/09/2016 | Stephen Las Marias, I-Connect007

At the recent NEPCON China show in Shanghai, I interviewed Adam Sim, senior sales manager at Speedline ITW EAE, about the challenges in solder stencil printing, how printing cycle times may be improved, and the key factors to consider when selecting a solder paste printing solution.