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Alpha Assembly Solutions, the world leader in the production of electronic soldering materials, is pleased to announce that ALPHA Argomax 9000 Silver Sintering Preforms won the award under the materials category of Sangyo Times. This prestigious award was presented to Alpha by Semiconductor Device Newspaper - Sangyo Times Inc. on June 1 at the 22nd Semiconductor of the Year 2016 in Tokyo Big Sight during the JPCA show. Alpha won for No.1 share of nano-paste & improvement of customer support system. The ALPHA Argomax 9000 Preform was selected among 34 new materials that were introduced to the market between March of 2015 and April of 2016.
Backed by novel patent-pending sintering application processes, ALPHA Argomax 9000 preforms are uniquely positioned to fit into existing manufacturing equipment and processes to enable high volume manufacturing. “Argomax silver die attach preforms combine unique physical properties of nanosilver powder and innovative chemical formulations into a revolutionary product,” said Oscar Khaselev, Director of R & D and also the innovator of this technology. “This process produces an extremely reliable, high thermal and electrical conductivity interface when joining various electronic devices.”
Argomax sinter technology covers a wide variety of devices and applications from large area thyristors and power modules for electrical and automotive equipment to miniature discrete components for mobile technology and LED lighting. The technology improves performance of existing power devices and increases their reliability 5 to 10 times compared to traditional joining techniques. ALPHA Argomax Preforms enable use of the new high temperature SiC and GaN devices with efficiency unattainable with the existing technologies. They can also replace extremely hazardous lead-tin and expensive gold-tin solders enabling environmentally safe and low-cost production.
ALPHA Argomax 9000 Silver Sintering Preforms are a world first for the Power Semiconductor Industry. For more information on these innovative and high reliable preform materials and our global services and capabilities, visit the Alpha Assembly Solution site.
About Alpha Assembly Solutions
Alpha Assembly Solutions, a MacDermid Performance Solutions Business, is the global leader in the development, manufacturing and sales of innovative specialty materials used in a wide range of industry segments, including electronics assembly, power electronics, die attach, LED lighting, photovoltaics, semiconductor packaging, automotive and others.
With a unique global presence in over 30 locations throughout the Asia Pacific, Americas and Europe regions, Alpha supplies a full line of ALPHA electronics assembly material products, including Solder Paste, Exactalloy Solder Preforms, Cored Solder Wire Solder, Wave Soldering Fluxes, Bar Solder Alloys, and Stencils. It offers die attach product technologies to the power electronics segment in its Argomax, Atrox™ and Fortibond™ brands.
For the LED segment, Alpha offers its Lumet™ products covering applications from die attach to systems assembly in the LED manufacturing process. Alpha also offers product technologies for the Photovoltaic segment, including high performance liquid fluxes and solder alloys for producing standard ribbon and bus bar, as well as, solder pastes, cored wire, conductive adhesives and preforms for use in PV module assembly. Also, Alpha’s Advanced Materials unit is the leader in electronic polymers and solder materials for semiconductor packaging applications.
Since its founding in 1872, Alpha has been committed to developing and manufacturing the highest quality specialty materials. For more information, click here.