ALPHA Argomax 9000 Silver Sintering Preforms Wins Prestigious Award at JPCA Show


Reading time ( words)

Alpha Assembly Solutions, the world leader in the production of electronic soldering materials, is pleased to announce that ALPHA Argomax 9000 Silver Sintering Preforms won the award under the materials category of Sangyo Times. This prestigious award was presented to Alpha by Semiconductor Device Newspaper - Sangyo Times Inc. on June 1 at the 22nd Semiconductor of the Year 2016 in Tokyo Big Sight during the JPCA show.  Alpha won for No.1 share of nano-paste & improvement of customer support system. The ALPHA Argomax 9000 Preform was selected among 34 new materials that were introduced to the market between March of 2015 and April of 2016.

 Backed by novel patent-pending sintering application processes, ALPHA Argomax 9000 preforms are uniquely positioned to fit into existing manufacturing equipment and processes to enable high volume manufacturing. “Argomax silver die attach preforms combine unique physical properties of nanosilver powder and innovative chemical formulations into a revolutionary product,” said Oscar Khaselev, Director of R & D and also the innovator of this technology.  “This process produces an extremely reliable, high thermal and electrical conductivity interface when joining various electronic devices.”

Alpha2.jpg

Argomax sinter technology covers a wide variety of devices and applications from large area thyristors and power modules for electrical and automotive equipment to miniature discrete components for mobile technology and LED lighting. The technology improves performance of existing power devices and increases their reliability 5 to 10 times compared to traditional joining techniques.  ALPHA Argomax Preforms enable use of the new high temperature SiC and GaN devices with efficiency unattainable with the existing technologies.  They can also replace extremely hazardous lead-tin and expensive gold-tin solders enabling environmentally safe and low-cost production.

ALPHA Argomax 9000 Silver Sintering Preforms are a world first for the Power Semiconductor Industry. For more information on these innovative and high reliable preform materials and our global services and capabilities, visit the Alpha Assembly Solution site.

About Alpha Assembly Solutions

Alpha Assembly Solutions, a MacDermid Performance Solutions Business, is the global leader in the development, manufacturing and sales of innovative specialty materials used in a wide range of industry segments, including electronics assembly, power electronics, die attach, LED lighting, photovoltaics, semiconductor packaging, automotive and others.

With a unique global presence in over 30 locations throughout the Asia Pacific, Americas and Europe regions, Alpha supplies a full line of ALPHA electronics assembly material products, including Solder Paste, Exactalloy Solder Preforms, Cored Solder Wire Solder, Wave Soldering Fluxes, Bar Solder Alloys, and Stencils.  It offers die attach product technologies to the power electronics segment in its Argomax, Atrox™ and Fortibond™ brands.

For the LED segment, Alpha offers its Lumet™ products covering applications from die attach to systems assembly in the LED manufacturing process.  Alpha also offers product technologies for the Photovoltaic segment, including high performance liquid fluxes and solder alloys for producing standard ribbon and bus bar, as well as, solder pastes, cored wire, conductive adhesives and preforms for use in PV module assembly. Also, Alpha’s Advanced Materials unit is the leader in electronic polymers and solder materials for semiconductor packaging applications. 

Since its founding in 1872, Alpha has been committed to developing and manufacturing the highest quality specialty materials.  For more information, click here.

 

Share




Suggested Items

VJ Electronix: Automating the X-ray Inspection Process

05/04/2022 | Nolan Johnson, I-Connect007
VJ Electronix's Brennan Caissie shares the benefits of a new inspection tool that can be used on a variety of boards, with an automated system that takes the pressure off the manufacturing floor operators and can provide feedback all the way to the design process.

Dave Hillman on Living Your Passion

03/29/2022 | Barry Matties, I-Connect007
Barry Matties leads this engaging retrospective conversation with Dave Hillman, a Fellow, Materials and Process engineer at Collins Aerospace, who talks about mentorship, pandemic changes, and solder. “Soldering is soldering,” Dave says. “But how we do that keeps evolving in response to the new technologies and smaller packages.” What’s the key to his success and longevity? “Find your passion.” Here’s how he’s done it.

IPC’s Dieter Bergman Fellowship Award Presented to Bev Christian, HDPUG

03/14/2022 | Patty Goldman, I-Connect007
The Dieter Bergman IPC Fellowship Award is given to individuals who have fostered a collaborative spirit, made significant contributions to standards development, and have consistently demonstrated a commitment to global standardization efforts and the electronics industry. Bev Christian is a facilitator for the High Density Packaging User Group (HDPUG) and an adjunct associate professor in the Department of Mechanical and Mechatronics Engineering of the University of Waterloo, Waterloo, Ontario, Canada. In the past 31 years he has held positions at Nortel, BlackBerry, and CALCE; all in the areas of materials and failure analysis. Bev has never missed an IPC APEX EXPO since its inception. He is a member of 27 IPC committees and attends as time and the lack of clones allow.



Copyright © 2022 I-Connect007. All rights reserved.