IPC Standards Committee Reports, Part 2 – Assembly and Joining, Component Traceability, Flexible Circuits, High Speed/High Frequency
These standards committee reports from IPC APEX EXPO 2016 have been compiled to help keep you up to date on IPC standards committee activities. This is the second in a series of reports.
Assembly and Joining
The 5-20 Product Assurance Committee reviewed the status of the projects in its scope and started planning for the meetings to be held at the 2016 Fall Standards Meetings in September.
The 5-21A Component mounting subcommittee met to discuss the update of the Guidelines for Printed Board Component Mounting. The new document, IPC-7070 will be created by combining parts of IPC-770, IPC-7351B, IPC-7093 and IPC-7095. The goal is to gather all the component information into one document to make it more user friendly.
The 5-21f Ball Grid Array Task Group continued its review of the D revision of IPC-7095, Design and Assembly Process Implementation for BGAs. The task group identified several areas to be updated or added, including column grid arrays and solder column assembly, addressing 0.3-mm and variable pitches and supply chain issues.
The 5-21g Flip Chip Mounting Task Group met to solicit feedback on topics which need to be updated or added in IPC-7094, Design and Assembly Process Implementation for Flip Chip and Die Size Components. Based on the number of significant changes requested by industry, the group will determine if IPC-7094 requires a full revision or an amendment. Topics under consideration include wafer-level fan-in/fan-out processes, very fine pitches and high I/O variations.
The 5-21h Bottom Termination Components Task Group reviewed proposed new content and content updates for the A revision of IPC-7093, Design and Assembly Process Implementation for Bottom Termination SMT Components. The group has identified several needs to bring the document up to current technology, including addressing low-temperature alloys, adding pictures of latest-technology BTCs, discussing 1-mm to 4-mm BTCs and managing supply chain issues.
The 5-22a J-STD-001 Task Group reviewed comments on IPC J-STD-001, Requirements for Soldered Electrical and Electronic Assemblies. This task group met to resolve comments on criteria common to both IPC J-STD-001, Requirements for Soldered Electrical and Electronic Assemblies, and IPC-A-610, Acceptability for Electronic Assemblies. For the first time, the group also met at the same time with the Task Groups working on IPC-A-610, Acceptability for Electronic Assemblies and IPC/WHMA-A-620 Requirements and Acceptance for Cable and Wire Harness Assemblies to resolve differences between the three documents addressing the same criteria.
The 5-22ad Requirements for Military Systems Work Group continued a discussion on content to address hardware contracted by the U.S. Department of Defense and used in military systems. They previously discussed a separate addendum, however during this meeting, they took action to review the J-STD-001FS, Space Applications Electronic Hardware Addendum to IPC J-STD-001F Requirements for Soldered Electrical and Electronic Assemblies. They are considering a joint effort with that Task Group.
The 5-22as Task Group discussed review comments from the Final Industry Review of the addendum to 5-22as, Space Applications Electronic Hardware Addendum to IPC J-STD-001F Requirements for Soldered Electrical and Electronic Assemblies.
The 5-22h Thermal Profiling Guide Task Group met to review final document needs for the task group to distribute the working draft of IPC-7530A, Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow & Wave) for comments. The task group plans to publish IPC-7530A by the end of the year. This will be the document’s first revision since its publication in 2001.
The 2-19a Critical Components Traceability Task Group worked through comments submitted to the working draft of IPC-1782, Standard for Traceability of Critical Items Based on Risk. Once the comments have been resolved, the task group will distribute IPC-1782 for Final Draft for Industry Review in early summer, with a goal to ballot the document for publication in late summer. This standard will establish minimum requirements for traceability of PCB assembly parts and processes throughout the entire supply chain, with particular initial emphasis on component traceability.
The D-11 Flexible Circuits Design Subcommittee met to resolve comments to the Final Draft for Industry Review of IPC-2223D, Sectional Design Standard for Flexible Printed Boards. Comments addressed flexible cross-sectional construction examples and factors that affect impedance and capacitance control for flex and rigid-flex printed board applications. The document will be balloted for a targeted Q3 2016 release.
The D-12 Flexible Circuits Performance Subcommittee met to advance the Working Draft to IPC-6013D, Qualification and Performance Specification for Flexible Printed Boards. The group addressed issues involving bends, folds, wrinkles and creases in cover film materials and also reviewed criteria for plated microvia structures.
High Speed/High Frequency
The D-22 High Speed/High Frequency Performance Subcommittee met to resolve negative votes to IPC-6018C, Qualification and Performance Specification for High Frequency (Microwave) Printed Boards. The group also began the review of comments to the Final Draft for Industry review of the corresponding IPC-6018CS Space and Military Avionics Applications Addendum. Both documents are targeted for a Q3 2016 release.
The D-24a TDR Test Methods Task Group met to review data from the Gage R&R Validation Program for the forthcoming “B” Revision to IPC-TM-650, Method 220.127.116.11, Characteristic Impedance of Lines on Printed Boards by TDR, ahead of its submission to the IPC 7-11 Test Methods Subcommittee for approval and release.
The D-24b Bereskin Test Methods Task Group met to prepare the official project request (IPC TAEC PIN) addressing the Bereskin stripline resonator test method that lends itself to the test and measurement of Dk and Df of thin dielectric materials up to 20 GHz. A 1st Working Draft of the new method will be provided for review and comment in May 2016.
The D-24c High Frequency Test Methods Task Group meet to review data from five participating companies in a round robin test program that will assess the state-of-the-art of test material provides and testing labs in the measurement of dielectric properties of materials at frequencies above 10 GHz. A variety of test methods are being utilized based on current practices utilized in commerce.