Avnet Continues to Move Up on the FORTUNE 500


Reading time ( words)

Global technology distributor Avnet, Inc.’s continued revenue growth was recognized by FORTUNE Magazine. The well-respected magazine unveiled that Avnet ranked No. 102 on the 2016 FORTUNE 500 list of largest U.S. companies, improving six places from its previous ranking.

“Avnet’s ranking on the FORTUNE 500 reflects our team’s ongoing commitment to growth,” said Rick Hamada, CEO of Avnet, Inc. “We have a unique view into how rapidly changing technology is creating new choices, connections and opportunities across our global landscape. We’re applying these insights to position us, along with our customers and suppliers, to capitalize on these changes and stay on the path to success today, tomorrow and for the long term.”

Avnet continues to evolve its business globally to position its suppliers and customers for mutual growth opportunities. For example, Avnet has already strengthened its market position in its 2016 fiscal year through the acquisitions of Orchestra Service GmbH and ExitCertified®, and invested in innovative, next-generation market opportunities related to the Internet of Things, embedded solutions and third-platform technologies. At the same time, Avnet returned approximately $400 million to shareholders through the first nine months of its 2016 fiscal year through its disciplined share repurchase and dividend programs.

With its strong financial position and commitment to growth, this marks Avnet’s 22nd year on the FORTUNE 500. FORTUNE also recently recognized Avnet on its “World’s Most Admired Companies” list in the Wholesaler: Electronics and Office Equipment category for the tenth year in a row.

Share

Print


Suggested Items

Solder Paste Printing From the Stencil’s Perspective

02/19/2020 | I-Connect007 Editorial Team
Jeff Schake of ASM Assembly Systems discusses the complications surrounding printing and solder paste that he sees from his perspective as a stencil expert.

IPC APEX EXPO 2020 Attendees Speak: Dr. Martin Anselm

02/14/2020 | I-Connect007 Editorial Team
"The biggest challenge I’ve encountered a number of different times is the migration to much larger packaging," said Dr. Martin Anselm, director of CEMA Lab. "Devices are getting much larger, and with the thousands of I/O of solder joints, and they are not just single-die, multi-chip modules in different forms or 2.5D technologies.

IPC Government Relations Team Offering Education and Fun at IPC APEX EXPO

01/07/2020 | Chris Mitchell, IPC Vice President of Global Government Relations
This year’s IPC APEX EXPO is going to be especially interesting for anyone interested in government policies that affect the electronics industry and what IPC is doing to influence them. Your IPC Government Relations team is preparing a variety of activities to educate and engage you on these issues. IPC's Chris Mitchell discusses some of the highlights attendees will see at IPC APEX EXPO from a Government Relations perspective.



Copyright © 2020 I-Connect007. All rights reserved.