SMTA Capital Chapter June Tutorial 'Electronic Manufacturing Fundamentals' a Great Success


Reading time ( words)

The SMTA Capital Chapter is pleased to announce it hosted Martin K. Anselm, Ph.D., Rochester Institute of Technology, on June 2nd for a tutorial on SMT Principles in Baltimore. The tutorial was a great success with over 25 attendees. New chapter members were welcomed at the event.  The tutorial concluded with a tour of Zentech Manufacturing for the attendees. 

“We would sincerely like to thank Dr. Martin Anselm of Rochester Institute of Technology for making the trip from New York to Baltimore to present at our chapter tutorial. The presentation and interactive dialogue were both tremendous and Dr. Anselm met the challenge head-on of laying the technical foundation in the early session for those less experienced so that the technically in-depth afternoon session benefitted all attendees” said John Vaughan, VP of Technical Programs, Capital Chapter.

Visit smta.org to view upcoming learning opportunities and to register for the SMTA Capital Chapter Expo scheduled for August 30th at Johns Hopkins University/Applied Physics Lab, Kossiakoff Center, 11100 Johns Hopkins Road, Laurel, Maryland, 20723.  Registration is free.

About SMTA: 30 Years Developing Solutions in Electronics Assembly

The SMTA membership is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations.

Share

Print


Suggested Items

SMTAI 2019: Lenora Clark Discusses Company Changes and Her New Role

10/02/2019 | Real Time with...SMTAI
Lenora Clark, director of autonomous driving and safety technology at MacDermid Alpha Electronics Solutions (and co-organizer for the upcoming SMTA Additive Electronics Conference), and Nolan Johnson discuss her new role, recent company reorganization, and the synergies customers are seeing.

3D Optical Inspection Provides ‘Eyes’ for Process Improvements in Industry 4.0

06/21/2019 | Jenny Yuh, Koh Young Technology, and Brent Fischthal, Koh Young America
Automated 3D solder paste inspection (SPI) and 3D automated optical inspection (AOI) systems have become an integral part of the printed circuit board assembly (PCBA) process because they help ensure high-quality production. As today’s board complexity is increasing, inspection technology has become even more critical.

Smart Factory Transitions Are Attainable—With a Plan

06/04/2019 | Nolan Johnson, I-Connect007
In a white paper, Zac Elliott, technical marketing engineer at Mentor, a Siemens company, outlines a structured organization for smart factory implementation. While there can be one set of challenges to overcome when building a smart factory on a greenfield site, firms restricted to pre-existing facilities face a different set of hurdles. In this interview, Elliott discusses how things have proceeded since the paper was published, and talks about strategies for smaller firms and brownfield companies.



Copyright © 2020 I-Connect007. All rights reserved.