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Selecting a Selective Soldering System, Part 3
June 13, 2016 | Robert Voigt, DDM NovastarEstimated reading time: 1 minute
In the previous two chapters on selective soldering, we covered the different applications well-suited to this technology, and the various types of fluxing methods available. In this column, we’ll cover the common types of soldering technologies available, plus nitrogen inerting systems.
Soldering Technologies
It’s important to remember that selective soldering does not necessarily replace a wave machine, because wave soldering is still the most efficient method of processing boards with only through-hole components. But selective is essential for a mixed technology board, and depending on the nozzle type used, can replicate the wave technique in a compact way.
Nozzle Types
Jet (or wave) soldering is similar to wave in that it’s uni-directional and provides the same benefits as wave. Its smallest solder diameter is 4 mm, it requires minimal maintenance, and it is fairly low cost. The nozzle type you use will depend on the make-up of the board and the location of SMDs on that board.
For instance, a fairly large row of connectors/leads not in close proximity to SMD components could use a wide nozzle to swipe (or wave) the entire row at once. A small area closed situated to an SMD would require a very small nozzle to avoid disturbing the surface mount device.
Jet nozzles attack the board at about the same angle (7°) as a wave machine and can deliver a high volume of solder using a tapered tip which guides solder roll-off in one direction returning unused solder back to the pot from its trailing edge. In this scenario, the direction of travel (board or nozzle) is very important.
Jet nozzles are long-lasting and usually cost only a few hundred dollars. Some boards can benefit from a custom nozzle to solder an area as quickly as possible in a dip or drag process, or even a min-wave.
• Pros: Many nozzle types, including custom configurations, can be used for most efficient speed and high quality, if the board population permits it
• Cons: Boards (or solder pot) can only move in one direction making programming a little more complex
Editor's Note: This article originally appeared in the June 2016 issue of SMT Magazine.
Suggested Items
How to Specify a Custom Machine
09/16/2016 | Robert Voigt, DDM NovastarLet’s say you have an unusual product configuration, a unique space requirement, an unorthodox handling system, or an application totally unrelated to the PCB or SMT assembly business, and you can’t find a standard machine provider that can handle your requirements. What then? This article highlights key points to consider when going the custom machine way for your project.
DDM Novastar Schedules Fall Technical Workshop
08/22/2016 | DDM Novastar Inc.DDM Novastar will be holding a technical workshop on the fundamentals of paste, place and reflow, to be held from September 14–15, 2016 at the company’s facility in Pennsylvania, U.S.A.
DDM Novastar Delivers Custom Pick-and-Place Machine
08/16/2016 | DDM Novastar Inc.DDM Novastar has shipped a custom pick-and-place machine to a large multinational laser cutting tool manufacturer.
Selecting a Selective Soldering System, Part 5
08/08/2016 | Robert Voigt, DDM NovastarFor the conclusion of his series on selective soldering discussion, Robert Voigt does a quick wrap-up to remind potential buyers about some important considerations that affect the purchase decisions they make.
Improving Test and Inspection
07/05/2016 | Stephen Las Marias, I-Connect007In our recent survey on PCBA test and inspection challenges, respondents consider the following to be among their biggest problems: probing to narrower traces and pads; testing boards with smaller and finer features and sizes; dry solder and other solder-related issues; finding sublayer defects; dealing with flat, no-lead components; and testing cycle time. This month, we look into different PCBA test and inspection strategies that address the key challenges in today’s electronics manufacturing and assembly environment.