-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueBox Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
Boost Your Sales
Every part of your business can be evaluated as a process, including your sales funnel. Optimizing your selling process requires a coordinated effort between marketing and sales. In this issue, industry experts in marketing and sales offer their best advice on how to boost your sales efforts.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
IWLPC 2016 Keynote Presenters Announced
June 17, 2016 | SMTAEstimated reading time: 2 minutes
The SMTA and Chip Scale Review magazine are pleased to announce the Keynote Presenters for the 13th Annual International Wafer-Level Packaging Conference (IWLPC), which will be held October 18-20, 2016 at the DoubleTree Airport Hotel in San Jose, California.
Klaus-Dieter Lang, Ph.D., Fraunhofer IZM is scheduled to give the keynote presentation on the first day of the conference on “Advanced Technology Platforms for Next Generation of Smart Systems.” The trend to establish smart electronic systems in an increasing number of application fields (e.g., Internet of Things) is enormous. But because of huge product variation, the main precondition to manufacture such systems is complex design tools, standardized leading edge processes, and system oriented test procedures. The allocation of innovative technology platforms (e.g., advanced assembly and packaging) and extended test principles (e.g., technology and functionality) are needed to achieve high yields and reasonable costs. Presentation topics include application conditions, integration technologies and reliability aspects for smart electronic systems. Examples from wearables, communication and production illustrate the advantage of their use.
Prof. Lang studied Electrical Engineering and received his M.S. Equivalent Diploma (Metallization Layers on GaAs). In 1985, he received his Ph.D. and in 1989 he received his Doctor of Technical Science. In 1993, he became Section Manager for Chip Interconnections at Fraunhofer IZM and from 2003 he headed the Department "Photonic and Power System Assembly.” Since 2011, he has been the Director of the Fraunhofer IZM and responsible for the chair "Nano Interconnect Technologies" at the Technical University Berlin.
Rao R. Tummala, Georgia Institute of Technology, Ph.D., will deliver the keynote on the second day, entitled "Promise and Future of Embedding and Fan-Out Technologies.” All packaging technologies can be classified into two types. Wafer-level packaging (WLP) is one approach with ICs built directly into packages in the wafer fab by simply redistributing the BEOL I/Os and placing bumps. This is the best package electrically, but it is limited to small ICs and to small packages—typically below 5mm. As such, it is limited in external I/Os to connect to the board, typically at 400 microns and above in pitch.
To eliminate the I/O limitation issue, fan-out technology was initially developed in the 1980s and more recently further developed into production by Infineon. But this technology is not a wafer-level packaging, as described above; it is not a continuum of transistors to bumps. It did, however, address the I/O limitation. It is primarily an embedded packaging technology called, eWLP, that allowed fan-out of I/Os, in contrast to WLP, but also enabled embedding to reduce package thickness. This presentation will describe the promise and future of embedding and fan-out technologies.
Prof. Rao Tummala is a Distinguished and Endowed Professor Chair at Georgia Tech. He is well known as an industrial technologist, technology pioneer, and educator. He is the father of LTCC and System-on-Package Technologies.
Suggested Items
Absolute EMS Champions Collaboration Between Humans and Robots in Modern Manufacturing
04/19/2024 | Absolute EMS, Inc.Absolute EMS, Inc., an award-winning EMS provider of turnkey contract manufacturing services, offers a perfect factory environment that seamlessly blends robotic automation with human expertise.
Microsoft, Google Join as Sponsors for First-Ever AI Expo for National Competitiveness
04/19/2024 | SCSPThe Special Competitive Studies Project (SCSP), a non-partisan, non-profit project dedicated to strengthening America’s long-term competitiveness in artificial intelligence (AI), announced today two additional sponsors of the AI Expo for National Competitiveness.
IDTechEx Explores the Role of 3D Cu-Cu Hybrid Bonding in Powering Future HPC and AI Products
04/18/2024 | PRNewswireSemiconductor packaging has evolved from traditional 1D PCB levels to cutting-edge 3D hybrid bonding at the wafer level, achieving interconnecting pitches as small as single micrometers and over 1000 GB/s bandwidth. Key parameters, including Power, Performance, Area, and Cost, are crucial considerations
Intel Brings AI-Platform Innovation to Life at the Olympic Games
04/18/2024 | BUSINESS WIREIntel announced its plans for the Olympic and Paralympic Games Paris 2024. Bringing AI Everywhere, Intel will implement artificial intelligence technology powered by Intel processors on the world’s biggest stage.
Adura Solutions Exhibits at Del Mar 2024
04/18/2024 | Adura SolutionsSumit Tomar, CEO of Adura Solutions, has announced that his company will be exhibiting at this year's Del Mar Electronics and Manufacturing Show to be held at the Del Mar Fairgrounds, San Diego, California, April 24-25.