EIPC Speednews: News from the European PCB Industry

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News from EIPC

- Review EIPC Summer Conference Edinburgh (June 9–10, 2016)

News from Belgium

- Ucamco updates Gerber Nested Step & Repeat Proposal

News from Luxembourg

- Review: Technology development in today’s global environment HDP User Group European meeting, May 25, 2016, Luxembourg

News from Germany

- Invitation to 24th FED Conference “Elektronikindustrie im Wandel - Technologien im Fokus”

News from the UK

- Amphenol purchases a Ledia 3-wavelength Direct Imager from Ucamco

- News from Polar Instruments

- ICT Evening Seminar at the Newtown House Hotel, Hayling Island, September 20

- Event Review: 7th Electronic Materials and Processes for Space Workshop (EMPS-7)

News from the USA

- Taiyo Announces Director & COO appointed to position of President and Director of Taiyo America Inc.

- Huntsman - Araldite Industrial Adhesives Website extends to include North America

News from WECC members

- News from IPC

Click here for the International Events Diary 2016



Suggested Items

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I recently sat down for an interview with Happy Holden, who is slated to give a keynote speech at this year’s AltiumLive event in Frankfurt, Germany. Happy gives a preview of his presentation, which is focused on smart factories and automation, and why artificial intelligence might improve PCB design and fabrication in the future.

Future of 'Substances and Materials in Products' Data Exchange Formats as Standards

10/16/2019 | Jean-Pierre Theret, Dassault Systèmes
This article provides a simplified, state-of-the-art description of the data exchange formats for standards covering substances and materials reporting in products and processes. It also reviews existing issues and new challenges shared with end users of the standards and companies represented by their trade associations with some solution proposals they could discuss.

Decreasing Bend Radius and Improving Reliability—Part I

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