Shenmao America to Showcase BGA, Micro BGA Solder Spheres at SEMICON WEST

Reading time ( words)

Shenmao America Inc. will be introducing its BGA and Micro BGA Solder Spheres at the upcoming SEMICON West event happening from July 12–14, 2016 at the Moscone Center in San Francisco, California.

Shenmao’s BGA Solder Spheres for PBGA, CBGA, TBGA, CSP and flip chip assemblies are made by UMT (Ultra Micron Technology) from highly pure metals produced to various exact alloy compositions using piezoelectric droplet jet technology. The solder spheres feature accurate diameter uniformity, bright shiny surface finishes and high quality sphericity. They are available in various diameters: 0.75, 0.6, 0.5, 0.45, 0.3, 0.25, 0.1, 0.08, 0.07, 0.06 and 0.05mm.

Shenmao will also be showcasing its High Drop-Resistance Alloy PF902-S (SAC0307X), which greatly increases reliability and performance of portable electronic devices drop test.

Shenmao will be at Booth 6467.

For more information, please contact: Shenmao America Inc. ( at 408-943-1755 or e-mail:



Suggested Items

High-reliability, Low-temperature Solder Alloys

05/18/2020 | Dr. Pritha Choudhury, MacDermid Alpha Electronics Solutions
Increased digitalization and greater connectivity have been driving miniaturization and more complex and integrated designs in electronics. As the real estate on PCBs shrinks, so does the size of packages. However, the drive for finding design solutions for increased performance has continued to expand. The solder joint is an essential part of assemblies for electronic devices as it provides electrical, thermal, and mechanical connections. Therefore, soldering materials have been evolving to enable such a technological revolution.

This Month in SMT007 Magazine: How Engineers Can Use SPI Tools for Verification

05/06/2020 | Nolan Johnson, I-Connect007
Koh Young’s Ray Welch and Brent Fischthal detail how engineers can work with SPI tools to verify how small they can go in component size with their solder paste application, and how the company’s SPI equipment is helping not only to verify but also to help drive the development collaboration between solder paste and stencil printer manufacturers, and inspection tools and software.

This Month in SMT007 Magazine: Indium Metal Forecast—Supply Chain Strong, Demand Continues to Grow

05/05/2020 | Donna Vareha-Walsh, Indium
Indium is a critical metal for the indium-tin oxide (ITO) market and other coating applications. Donna Vareha Walsh—director of sales and global supply chain and trade compliance at Indium Corporation—describes the plentiful global supply of indium and its recycling loop, examines indium’s history of price volatility and the market reactions from the recent Fanya Metal Exchange auction, and provides an overview of indium supply and demand drivers, as well as the impact of recycling efforts.

Copyright © 2020 I-Connect007. All rights reserved.