Everett Charles Technologies Launches LFRE-39 Probe


Reading time ( words)

Everett Charles Technologies (ECT) has expanded its comprehensive portfolio of products for lead-free test applications with the launch of the LFRE-39 spring probe. LFRE-39 features ECT's LFRE plating and is designed to meet fine pitch requirements down to 39 mil (1.0 mm). The LFRE-39 fully meets the demanding requirements of high volume production in-circuit and functional test.

LFRE plated probes are field proven to provide enhanced performance in high volume production test environments. LFRE probes are less prone to solder transfer and tip wear due to their exceptional hardness. Lead free solder and OSP (Organic Solderability Preservatives) treated copper pads typically present a harder or more abrasive contact surface causing excessive plating and probe tip wear. Customers report that LFRE plating has demonstrated longer life and MTBM (mean time between maintenance) on their most challenging applications. LFRE plating is significantly harder than typical gold plating. LFRE has a hardness range of 550 to 650 Knoop which is about 3 to 4 times harder than standard gold. This makes the probe tips more durable and less susceptible to solder and material transfer. LFRE plated probes are the best solution to contact RoHS compliant boards and OSP boards.

Lead free plating is featured on ECT’s industry standard PogoPlus® LFRE series, Metrix™, and on LFLT Long Travel probes.  With the addition of LFRE-39, ECT’s proprietary plating is now available on a wide range of pitch options.

Tony DeRosa, Product Manager, explains: “In head to head testing with traditional gold plated probes, LFRE plated probes offer lower and more consistent resistance. LFRE probes have also outperformed gold plated probes in high volume production test applications by 3 to 5% first pass yield improvement. With LFRE-39 we can provide a reliable test probe solution for fine pitch lead-free PCBA test fixture applications.”

About Everett Charles Technologies (ECT)

ECT (headquartered in Fontana, CA) is the world's leading manufacturer of POGO ® contact probes for a wide range of applications including industrial, medical, military, connectors and testing bare and loaded printed circuit boards. R&D programs address engineering and materials issues that will affect Contact Solutions for the next decade. Methods for maintaining electrical continuity in miniature probes, improved spring technologies, and probe head geometries are under continual review. ECT POGO ® contacts are marketed worldwide through sales offices in the United States, Europe and Asia. ECT is a company of Xcerra™ Corporation, which provides capital equipment, interface products, and services to the semiconductor, industrial, and electronics manufacturing industries. Xcerra Corporation offers a comprehensive portfolio of solutions and technologies, and a global network of strategically deployed applications and support resources.

Share

Print


Suggested Items

Clean vs. No-clean: A Generational Difference

12/24/2019 | Barry Matties, I-Connect007
Tom Forsythe, executive VP of KYZEN, discusses what readers should know about cleaning as reliability expectations continue to increase. He also explains what is driving the new interest in cleaning and why engineers from the no-clean generation may not even realize they need to learn more about cleaning.

UV-curable Materials and Conformal Coatings

12/23/2019 | Pete Starkey, I-Connect007
Pete Starkey and Phil Kinner, global business and technical director, coatings division, Electrolube, discuss the characteristics and benefits of the company’s new UV-cured conformal coatings. Phil also describes the development of coatings for critical avionics applications and Electrolube’s collaboration with the U.K. National Physical Laboratory to establish a new condensation test.

BTU Discusses its Next-generation Flux Management System

12/18/2019 | Nolan Johnson, I-Connect007
At productronica 2019, Nolan Johnson spoke with Peter Franklin, managing director of BTU Europe, about BTU’s next-generation solder reflow flux management system—Aqua Scrub. A winner of the show’s Global Technology Award for Soldering, Peter breaks down the specifics of what makes Aqua Scrub such an intriguing technology.



Copyright © 2020 I-Connect007. All rights reserved.