Improving Test and Inspection


Reading time ( words)

Our survey last month on the challenges manufacturers face regarding tighter tolerances, finer lines and features in assemblies provided us two key issues: solder paste printing challenges, which we covered in-depth in the June edition of SMT Magazine, and PCBA testing and inspection, the topic for this month’s issue.

It is interesting to note that in our recent survey on PCBA test and inspection challenges, most respondents consider these same subjects to be among their main problems. Some of those problems include: probing to narrower traces and pads; testing boards with smaller and finer features and sizes; dry solder; and other solder-related issues that cannot be easily detected during PCBA testing. Other challenges include finding sublayer defects; dealing with flat, no-lead components; and testing cycle time, as more manufacturers grapple with high-mix, low-volume production issues.

On top of dealing with increasingly complex and higher-density boards, assemblers are also facing tougher requirements such as data traceability, changes in IC packaging structure, embedded substrates and modules, and thermal conductivity, according to our survey.

Innovation Wish List

To help address their challenges, respondents are looking for innovations such as better boundary scan capability and better test equipment that find latent defects in electrical testing. From an optical test/inspection, they said innovations such as better lighting and focal plane depth are key. They are also looking for CAD/CAM systems that could suggest the best test implementation, as well as software to economically automate functional test of low-volume production runs.

Meanwhile, the majority of our respondents say they are planning to purchase new test and inspection equipment this year. Assemblers are looking to acquire equipment such as ICT for high-power device testing, benchtop instruments, SPI, 3D AOI and AXI systems, and RF test systems for their test and inspection process. This month, we look into different PCBA test and inspection strategies that address some of the key challenges in today’s electronics manufacturing and assembly environment.

Read The Full Article Here

Editor's Note: This article originally appeared in the July 2016 issue of SMT Magazine.

Share


Suggested Items

Electrolube on Managing Thermal Interfaces and Conformal Coatings

12/03/2018 | Pete Starkey, I-Connect007
Electrolube's Jade Bridges, global technical support manager, speaks with I-Connect007 Technical Editor Pete Starkey about how to manage thermal management interfaces for maximum heat transfer efficiency. She also provides an update on conformal coatings.

U.S. Career Opportunities with Electrolube

11/27/2018 | Pete Starkey, I-Connect007
In a recent interview, Julia Vorley, group marketing manager for Electrolube, discusses a career opportunity Electrolube is seeking in the U.S. Read on to hear what they’re looking for in a technical account manager.

Do's and Don'ts of Thermal Management Materials

10/17/2018 | Jade Bridges, Electrolube
Selecting a thermal management material that is broadly applicable to a particular electronic assembly and its predicted operating conditions is a good starting point; however, as with many of these things, the devil is very much in the details! Find out the key considerations in choosing your materials.



Copyright © 2018 I-Connect007. All rights reserved.