Invensas and Jabil Collaborate to Qualify BVA Interconnect Technology


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Tessera Technologies Inc.'s wholly owned subsidiary Invensas Corp. and Jabil, one of the world's leading design and manufacturing product solution providers, have completed the first phase of qualification of Invensas Bond-Via-Array (BVA) interconnect technology.

"BVA is a proven high density, 3D interconnect technology for Package-on-Package (PoP) and System-in-Package (SiP) applications," said Craig Mitchell, president, Invensas. "As an established leader in the manufacture of a diverse array of electronic products, Jabil's identification of BVA as the benchmark for fine pitch package stacking is yet another validation of the value that this technology brings to the industry."

Jabil's interest stems from a desire to address customer requirements to mount fine pitch stacked packages to printed circuit boards (PCBs) with high yield and high throughput. In order to optimize the PCB assembly process of BVA-based packages for high volume production and ensure a complete manufacturing ecosystem, Jabil will also collaborate with Fuji Machine Mfg. Co. Ltd, a leading provider of surface mount technology equipment. The two companies are well suited to make significant contributions in the form of novel and proprietary PCB assembly processes.

"Invensas BVA technology is a low-cost, versatile package stacking solution that is capable of scaling to very fine pitch," said Dan Gamota, vice president of strategic capabilities, Jabil. "At Jabil, we expect such innovative packaging solutions, and our ability to assemble them to PCBs, will be required to address the demand for ever increasing performance and functionality in future customer products. We look forward to continuing to work with Invensas as we explore uses of this important technology."

Invensas BVA technology provides the industry with a scalable package stacking platform that leverages existing manufacturing infrastructure while delivering unmatched tolerance to process variations; this translates into improved yield and cost efficiencies. The technology can be used to provide cost effective 3D interconnect solutions for Package-on-Package (PoP), System-in-Package (SiP) and a range of other packaging applications.  

About Tessera Technologies

Tessera Technologies, Inc., including its Invensas and FotoNation subsidiaries, licenses technologies and intellectual property to customers for use in areas such as mobile computing and communications, memory and data storage, and 3D-IC technologies, among others. Our technologies include semiconductor packaging and interconnect solutions, and computational imaging and computer vision products and solutions for mobile and other vision systems.  

Tessera, the Tessera logo, Invensas, the Invensas logo, Bond-Via-Array and BVA, are trademarks or registered trademarks of affiliated companies of Tessera Technologies, Inc. in the United States and other countries. All other company, brand and product names may be trademarks or registered trademarks of their respective companies.

About Jabil

Jabil is an electronic product solutions company providing comprehensive electronics design, production and product management services to global electronics and technology companies. Offering complete product supply chain management from facilities in 28 countries, Jabil provides comprehensive, individualized-focused solutions to customers in a broad range of industries.

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