Indium Features Indium8.9HF, Indium10.1 Solder Pastes at NEPCON South China


Reading time ( words)

Indium.jpgIndium Corporation will feature its Indium10.1 and Indium8.9HF solder pastes at NEPCON South China 2016, on Aug. 30-Sept. 1, in Shenzhen, China. 

Indium Corporation, the industry-leading source of void-reducing materials and results, has specifically formulated Indium10.1 solder paste to reduce voiding significantly below the industry average – for improved finished goods reliability. Indium10.1 delivers robust reflow capabilities and a wide processing window, which accommodates various board sizes and throughput requirements, and minimizes defects.

For a halogen-free option, Indium8.9HF solder paste delivers very low voiding. Its unique oxidation barrier technology makes it perfectly suited for a variety of applications, especially automotive assembly.

In addition to outstanding print transfer and excellent response-to-pause, Indium10.1 and Indium8.9HF both provide excellent pin-in-paste solderability and hole-fill.

For more information about Indium Corporation, click here.

Share

Print


Suggested Items

Congratulations to Steve Pudles! IPC Hall of Fame 2020 Inductee

02/20/2020 | Patty Goldman, I-Connect007
With over 32 years spent working with IPC, Steve Pudles was elected to the IPC’s Hall of Fame this year. Patty Goldman spoke with Steve about how he first became involved as well as his time in the organization, including his work with the EMS Management Council.

Solder in PCBA: Can’t Live Without It... or Can We?

02/17/2020 | Joe Fjelstad, Verdant Electronics
For most of its historical use in electronics, the solder alloy of choice was tin-lead, either an Sn60/Pb40 alloy or the Sn63/ Pb37 eutectic version of the tin-lead alloy. These two alloys were the workhorses of the industry. They were both well understood in terms of their processing and reliability—that is, until the advent of lead-free, a well-meaning but ill-conceived and poorly executed conversion, forced on the industry by the European Union in 2006.

True or False: CFX Edition

02/06/2020 | David Bergman, vice president, Standards and Training, IPC
Early in 2019, IPC published IPC-2591— Connected Factory Exchange (CFX), Version 1.0. This standard was developed by the IPC Connected Factory Initiative Subcommittee over a two-year period to address issues with machine-to-machine communication and provide the electronics manufacturing industry with a true plug-and-play system for any company to achieve Industry 4.0.



Copyright © 2020 I-Connect007. All rights reserved.