Dual Stage Testing of Complex PCBAs: ECT’s Pneumatic Keysight 307x Fixtures

Reading time ( words)

Everett Charles Technologies (ECT) offers reliable and efficient test solutions for complex Printed Circuit Board Assemblies (PCBAs) in low to high volumes. The ECT Pneumatic Actuated Keysight 307x In-Circuit Test Fixture meets the test requirement for PCBAs with high test point counts, single or dual side access, and dual stage testing.

The ECT Pneumatic Actuated Keysight 307x In-Circuit Test Fixture supports ESD safe test of complex PCBAs with 39 mil center-to-center test points. It allows for testing in two stages with 80% of the test contact occurring in the 2nd stage using long travel probes. These dual stage tests usually apply for ICs that also require cooling during power up testing.

Leveraging ECT’s unique fixture design and engineering skills, the optimized manufacturing process and quality controls, the Pneumatic Actuated Keysight 307x In-Circuit Test Fixture is a reliable test solution with consistent quality and short delivery times of less than 20 days, which supports the  fastest time to market of the end product.

Thomas Merline, Director of North America Sales, explains: “We continue to successfully complete multiple customer projects, deployed in North America and Asia, with this solution for the in-circuit test of complex PCBAs. Our solution fully met the expectations and provided our customers a reliable and efficient test at their contract manufacturing sites.”

About Everett Charles Technologies (ECT)

The Everett Charles Technologies (ECT) Fixtures and Services Group (headquartered in Singapore) is the world's leading manufacturer and customizer of fixtures for testing loaded printed circuit boards. ECT was the first to provide a patented ESD protection process to our fixture products and many other fixture technologies that are now considered “industry standard” including Zero-Flex, Guided Probe, Receptacle Alignment plates, and Board Stress Analysis. ECT is a company of Xcerra™ Corporation, which provides capital equipment, interface products, and services to the semiconductor, industrial, and electronics manufacturing industries. Xcerra Corporation offers a comprehensive portfolio of solutions and technologies, and a global network of strategically deployed applications and support resources.  



Suggested Items

The Long Road to a New Standard

09/17/2019 | Barry Matties, I-Connect007
Graham Naisbitt, chairman and CEO of Gen3 Systems, has spent decades leading cleanliness testing standards in a number of different standards organizations like IPC, IEC, and ISO around an assortment of testing methods, such as CAF, SIR, and even introducing a new standard this year for his own testing method—process ionic contamination testing (PICT). Naisbitt breaks down his long involvement with standards and where they stand currently.

The Four Things You Need to Know About Test

07/24/2019 | Neil Sharp, JJS Manufacturing
The electronics manufacturing process can often be extremely complex, and the costs associated with product recalls can be astronomical. A robust approach to test is key to ensuring the quality of your product and the satisfaction of your end user.

Approaches to Overcome Nodules and Scratches on Wire-Bondable Plating on PCBs

07/17/2019 | Young K. Song and Vanja Bukva, Teledyne Dalsa Inc., and Ryan Wong, FTG Circuits
Initially adopted internal specifications for acceptance of printed circuit boards (PCBs) used for wire bonding was that there were no nodules or scratches allowed on the wirebond pads when inspected under 20X magnification. This paper details if wire bonding could be successfully performed over nodules and scratches and if there was a dimensional threshold where wire bonding could be successful.

Copyright © 2020 I-Connect007. All rights reserved.