KIC’s MB Allen to Present 'Optimization of the Reflow Profile to Minimize Voiding'


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KIC today announced plans to participate in the SMTA Carolinas Chapter Tech Session, scheduled to take place Thursday, August 18th in Greenville, SC. The event will be hosted by Hubbell Lighting, Inc. MB (Marybeth) Allen will present “Optimization of the Reflow Profile to Minimize Voiding.”

Void reduction is a significant concern and controversial topic in electronic assembly. Voiding impacts electrical, thermal and mechanical performance. There are many variables such as substrates, components, solder paste, acceptable void levels and of course the reflow profile. This discussion will focus on the optimization of the reflow profile as one of the solutions for the reduction of voiding.

MB Allen is the Product Manager for KIC. As such she coordinates the advancement of new products and features to accommodate customer needs as KIC adds to its portfolio for the electronics industry. Her technical expertise, relationships with valued partners and customers, and many years of sales experience aid KIC in the future development, improvement and sales of the company's product offerings. MB has worked in the electronics industry for nearly 30 years and been associated with KIC for 26 years with both national and international positions.

Based in San Diego, KIC is the industry leader in automated thermal process tools and systems for reflow, wave, curing and semiconductor thermal processes. The company pioneered the development of oven profilers and process optimization tools, and then worked to create the next generation of thermal systems to help manufacturers improve the thermal process quality while reducing cost.

About KIC

KIC products include the KIC K2, X5, KICstart2, ProBot, 24/7 Wave and the KIC RPI. With the introduction of cutting edge tools, the company continues to stay on the leading edge of process optimization and automatic thermal process systems, and has won numerous industry awards.

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