Reading time ( words)
The SMTA Capital Chapter will be holding its Capital Expo and Tech Forum at Johns Hopkins University/Applied Physics Lab, Kossiakoff Center, 11100 Johns Hopkins Road, Laurel, Maryland 20723, on August 30.
During this year's expo, the Capital Chapter will host technical presentations by re:3D, Kyzen Corporation, Nokia, and MET Stencil. Specific topics include "How 3D Printing Hardware and New Materials are Changing the Face of Manufacturing," "Video Analysis of Solder Paste Release From Stencils," "Implementation of a Collaborative Industrial Consortia Program to Characterize the Thermal Fatigue Reliability of 3rd Generation Pb-Free Solder Alloys," and "An Investigation into the Use of Nano Coated Stencils to Improve Solder Paste Printing with Small Stencil Aperture Area Ratios."
Registration includes a complimentary lunch on the show floor as well as the opportunity to win numerous door prizes. Registration opens at 8:00 AM and the first technical presentation will start at 9:00 AM. Exhibits are open from 9:00 AM until 3:00 PM.
To register online to attend or exhibit, visit http://www.smta.org/expos/#capital.
Real Time with...IPC APEX EXPO
Nolan Johnson talks with Senior Product Manager Chris Nash of Indium Corporation, who discusses Durafuse LT, a novel solder paste mixed alloy system with highly versatile characteristics that enable energy savings, high-reliability, low-temperature, step soldering, and assemblies with large temperature gradients. It also provides superior drop shock performance to conventional low-temperature solders, outclassing BiSn or BiSnAg alloys, and performing better than SAC305 with optimum process setup.
Nolan Johnson, I-Connect007
Clemens Jargon, senior vice president of High Flex at Mycronic, shares his thoughts about the company’s performance in 2022 (it was a strong year), plans for the new year (turnkey solutions), and what visitors to the Mycronic booth at the show can expect to see in the company’s state-of-the-art Iris™ 3D AOI vision technology.
Andy Shaughnessy, I-Connect007
In this Q&A, Rob Rowland, director of engineering at Axiom Electronics, discusses his new IPC APEX EXPO Professional Development course, “Reflow Profiling Simplified,” on how to create a standardized methodology to accurately generate new reflow soldering profiles. Rob explains, “In this class, I’ll explain how I approached this work to help others develop similar methodologies for creating their own reflow soldering profiles. My presentation also includes the basic reflow profile recipes I have been using for the past 20 years.”