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Solder joint reliability plays a critical role in the reliability of the entire spectrum of end-use electronic products—from consumer to military, from computing to IoT, and from medical to avionic applications. In lead-free electronics, intermetallic compounds become increasingly important to the performance and reliability of solder interconnections in the chip level, package level and board level. Understanding the essential fundamentals and key factors behind intermetallics and solder joint reliability is a necessity to designing and manufacturing reliable products.
On September 25, Dr. Jennie S. Hwang leverages decades of extensive real-world experiences and deep knowledge to address solder joint reliability and the role of intermetallic compounds at the upcoming SMTA International event. Dr. Hwang will discuss relevant aspects of solder joint reliability at her Workshop 1, "Reliability of Electronics – The Role of Intermetallic Compounds", and Workshop 7, "Solder Joint Reliability - Principles and Applications". Attendees are encouraged to bring their own selected systems for deliberation.
For more information or to register, click here.