SHENMAO to Showcase BGA Solder Spheres and Bumping Paste at SEMICON Taiwan

Reading time ( words)

SHENMAO Technology Inc. will exhibit its BGA solder spheres for PBGA, CBGA, TBGA, MBGA, CSP and flip chip assemblies at the upcoming SEMICON Taiwan trade show, which will be held from September 7–9, 2016 at the Taipei Nangang Exhibition Center in Taipei, Taiwan.

Made by UMT (ultra micron technology) from highly pure metals produced to various exact alloy compositions using piezoelectric droplet jet technology, the BGA solder spheres feature accurate diameter uniformity, bright shiny surface finishes and high quality sphericity. They are also available in various diameters: 0.76, 0.6, 0.5, 0.45, 0.3, 0.25, 0.1, 0.08, 0.07, 0.06 and 0.05mm.Shenmao-23Aug16.jpg

SHENMAO will also put into display its high drop-resistance alloy PF902-S (SAC0307X), which greatly increases reliability and performance of portable electronic devices.

For more information, please contact SHENMAO Technology Inc. at +886-3-416-0177 or e-mail



Suggested Items

SMTAI 2019: Chris Bastecki on Low-temperature Solder Challenges and Products

10/14/2019 | Real Time with...SMTAI
Chris Bastecki, director of global PCB assembly at Indium Corporation, discussed challenges of low-temperature solder and the company's new product, Durafuse LT, which provides novel properties and reliability.

Real Time with... SMTAI 2019 Video Interviews

10/09/2019 | Real Time with...SMTAI
The SMTA International Conference and Exhibition 2019, which took place September 22–26, 2019, at the Donald E. Stephens Convention Center in Rosemont, Illinois, concluded successfully. For those of you who were not able to make it to the show, catch our video interviews with the movers and shakers of the electronics industry. We've updated our video presentation for a better experience for our users, so check it out!

SMTAI 2019: Happy Holden’s On-the-Scene Report

10/03/2019 | Happy Holden, I-Connect007
Last week concluded the 2019 SMTAI conference in Rosemont, Illinois. Overall, I think the show was successful and covered all aspects of SMT processes.

Copyright © 2019 I-Connect007. All rights reserved.